PHYSICAL VAPOR DEPOSITION

Multiple Choice

In the context of PVD, which of the following factors primarily affects the film's morphology and microstructure?

• Substrate temperature

• Substrate material

• Chamber pressure

• of the above

Multiple Choice

How is the pressure inside the vacuum chamber related to the vacuum level in an Electron Beam system?

• Higher pressure corresponds to a higher vacuum level.
  

• Lower pressure corresponds to a higher vacuum level.

• Pressure and vacuum level are unrelated.
  

• Vacuum level increases as pressure increases.

Multiple Choice

In a PVD system, what is the primary role of the vacuum chamber?

• To prevent oxidation of the deposited material

• To control the deposition rate

• To keep the substrate at a constant temperature

• To protect the source material from contamination

Multiple Choice

Which property of the target material significantly influences its evaporation rate?

• Coefficient of thermal expansion
  

• Atomic weight

• Vapor pressure

• Electrical conductivity

Multiple Choice

Which parameter is crucial for achieving film uniformity over a large substrate area?

• High deposition rate
  

• Optimized substrate rotation and filament geometry

• Low chamber temperature

• Low vacuum pressure

Multiple Choice

Which physical property of the source material determines its suitability for resistive evaporation?

• Density
  

• Electrical conductivity

• Melting point

• Thermal expansion

Multiple Choice

What is the principle behind resistive evaporation?

• High-energy plasma excitation

• Heating the material through electron beams

• Heating the material via resistive heating of a filament

• Deposition through chemical vapor reaction

Multiple Choice

What is the main advantage of resistive evaporation over other physical vapor deposition methods?

• Higher deposition rate

• Better uniformity for large substrates

• Simplicity and lower equipment cost

• Ability to coat complex geometries

Multiple Choice

In resistive evaporation, what is a common way to monitor the thickness of the deposited film?

• Visual inspection
  

• Quartz crystal microbalance

• Thermal imaging

• Mass spectrometry

Multiple Choice

Which of the following factors can affect the quality of the thin film in resistive evaporation?

• Substrate temperature
  

• Vacuum level

• Deposition rate

• All of the above

Multiple Choice

What is a common limitation of the resistive evaporation technique?

• High equipment cost
  

• High power consumption

• Not suitable for high melting point substance

• Inability to deposit insulating materials

Multiple Select

What happens if the vacuum level in the chamber is not sufficiently high during evaporation?

• The filament may overheat
  

• The evaporated material may react with residual gases

• The deposition rate may decrease significantly

• deposited material may get oxidised

Multiple Choice

The working principle of the Electron Beam (E-Beam) method is based on:

• The combustion of materials to generate heat

• The emission and acceleration of electrons under high voltage

• Magnetic induction to create a heat source

• Chemical reactions between electrons and materials

Multiple Choice

Why is the high-vacuum environment critical for E-Beam PVD?

• Prevents contamination of the deposited layer
  

• Ensures efficient electron beam focusing

• Reduces scattering of evaporated atoms
  

• All of the above

Open Ended

List two advantages of electron-beam evaporation over resistive evaporation