QUIZ 1

1. Which of The Following define the term Integrated Circuit

• A. The process of electrically connecting the input/output of the chip

• B. Component that are fabricated on insulator chip

• C. An electronic circuit formed on a small pieces of semiconductor material which performs the same function as a larger circuit made from discrete components

• D. Electronic circuits in which the components are mounted or placed directly onto the surface of the printed circuit board.

What are TWO (2) functions of integrated circuits

i. provides interconnection

ii. analogue devices

iii. Digital devices

iv. provides mechanical protection

• A. i and iv

• B. ii and iii

• C. i and iii

• D. iii and iv

Point out which of the following is the disadvantage of integrated circuit?

• A. Parameter within the IC cannot be modified

• B. Low power requirement

• C. ICs are considered to use minimum number of external connections

• D. Failure rate is low

The meaning of green packaging of Integrated Circuit is best described in which statement?

• A. Packaging that are safer for the environment

• B. All active and passive components are fabricated on a single silicon chip

• C. A method for producing electronic circuits in which the components are mounted directly on the surface

• D. Packaging that contains substances which is harmful for environment

Figure 1.0 above shows the inside of Dual In Line Packaging (DIP) of integrated circuit. What is the label the X

• A. Die

• B. Mold Resin

• C. Bonding Wire

• D. Leadframe

Which package type is chosen for military purposes?

• A. Ceramic Dual In Line Packaging

• B. Plastic Dual In Line Packaging

• C. Metal Can Packaging

• D. Plat Packaging

The quote in the box refers to

• A. Ohms Law

• B. Moore’s Law

• C. Evolution of DRAM

• D. Intel prediction

Small Scale Integration(SSI) refers to ICs with __________ gates on the same chip

• A. Fewer than 10

• B. Greater than 10

• C. Equal to 10

• D. Greater than 100

Give the major advantage of silicon as most widely use type of semiconductor material

• A. Better charge carrier

• B. Easy to fabricated and provides good general electrical and mechanical properties

• C. Lower hole mobility

• D. High speed and high power

An audio amplifier is an example of ………………

• A. Digital IC

• B. Linear IC

• C. Both digital and linear IC

• D. None of the above