Chiplet Introduction

What is ranking of Taiwan in semiconductor market size ?

• 1

• 2

• 3

• 4

Which one is not benefit of advanced process that we want ?

• Denser transistor density

• Higher yield

• Lower voltage supplied

• More power dissipation

Which one is not challenge of chiplet ?

• IO SI and PI

• Subtract cost

• EDA tools integration

• Thermal management

Which one is not important technology of chiplet ?

• Interconnect interface

• TSV

• Si interposer

• Wire bonding

What is FOWLP we mentioned in packaging technology ?

• Flat Of Water Level Proof

• First OWL Pokemon

• Fan Out Wafer Level Package

• Forecast Of West Located Paddy

Which one is not benefit of chiplet ?

• Time to market

• Compose with different node die

• Mask level enlarged

• Reusable die

Which interconnect protocol is license free ?

• Intel AIB

• Intel MDIO

• TSMC Lipincon

• Candence Ultralink

Which one dominates static current leakage in advanced nanometer process ?

• Junction fevers bias leakage

• Sub-threshold leakage

• Gate leakage (Direct tunneling)

• Gate induced drain leakage