PROCESS FLOW
Authored by emrans enna
English
Professional Development
Used 4+ times
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10 questions
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1.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
"Bahan pengendalian di Dicing dan Mounting" adalah kerja untuk proses ?
Wafer Taping
Wire Bond
Die Bond
2.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
"Potong wafer menjadi kepingan individu" adalah kerja untuk proses ?
Molding
Dicing
Die Bond
3.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
"Untuk memasang die ke rangka lead frame" adalah kerja untuk proses ?
Wire Bond
Dicing
Die Bond
4.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
Pilih gambar yang BETUL untuk cara kerja di MOLDING ?
5.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
Pilih gambar yang BETUL untuk cara kerja di WIRE BOND ?
6.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
Pilih gambar yang BETUL untuk cara kerja di MLCBS ( Mark, Lead Cut & Bend system ?
7.
MULTIPLE CHOICE QUESTION
10 sec • 1 pt
"Tie bar dipotong sebelum penyaduran" adalah kerja untuk proses ?
Lead scan
Testing
Tiebar Cut System
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