Chapter 4: Board Assembly

What is the main difference between Surface Mount Technology (SMT) and Through-Hole Technology (THT)?

• SMT components are much smaller than THT components

• SMT requires drilling holes in the PCB, while THT does not

• SMT components can only be mounted on one side of the board, while THT components can be mounted on both sides

• SMT components are more expensive than THT components

What is the purpose of Printed Wiring Board (PWB) assembly?

• To provide a protective casing for the components

• To cool down the electronic components

• To create electrical connections between different components

• To provide mechanical support for electronic components

Which technology is commonly used for mounting large and heavy components that require strong mechanical fastening to the board?

• Surface Mount Technology (SMT)

• Through-Hole Technology (THT)

• Wave Soldering Technology

• Axial Component Technology

What is the primary advantage of Surface Mount Technology (SMT) over Through-Hole Technology (THT)?

• SMT components are easier to solder than THT components

• SMT allows for lower cost and faster production time

• SMT components are more durable than THT components

• SMT components can handle higher currents than THT components

What is the key benefit of SMT in terms of PCB design and manufacturing?

• Increases the weight of electronic devices

• Reduces the number of components that can be placed on a PCB

• Allows for larger PCB size

• Enables denser, higher performing, and smaller PCBs

What is the advantage of using programmed reflow ovens for SMT over THT techniques?

• Easier repairs

• Faster placement rates

• Better visual inspection

• Higher placement accuracy

What are the two main categories of chip carriers for active components in board assembly?

• Ceramic and Metal

• Plastic and Ceramic

• Metal and Plastic

• Glass and Ceramic

What is the purpose of using adhesives in double side mixed assembly of PCBs?

• To increase thermal conductivity

• To prevent component damage

• To improve soldering efficiency

• To reduce overall cost

What is the main advantage of Wafer Level Packaging (WLP) in IC packaging technology?

• Improved thermal conductivity

• Higher placement accuracy

• Lower cost for IC packages

• Simplified manufacturing process

What is the purpose of using stencils in solder paste printing for board assembly?

• To apply solder paste accurately

• To align components optically

• To clean the board surface

• To create fiducials on the board