20EI2E23 Green Electronics Quiz -I

what is the final step in the IC manufacturing process before packaging?

• Wafer testing

• Lithography

• Deposition

• Doping

Lead (Pb) is commonly used in the soldering process of which electronic components?

• Surface Mount Devices (SMD)

• Integrated Circuits (IC)

• Printed Circuit Boards (PCB)

• Resistors

What is the primary use of lead (Pb) in electronics?

• To increase conductivity

• To improve mechanical strength

• To lower melting point

• To reduce corrosion

Which material is commonly used as a substrate in Printed Circuit Boards (PCBs)?

• Aluminum

• Copper

• Silicon

• Fiberglass

What is the purpose of Doping in the semiconductor manufacturing process?

• To increase resistance

• To introduce impurities for desired electrical properties

• To reduce conductivity

• To improve mechanical strength

Which process is used to create patterns on the wafer during IC manufacturing?

• Etching

• Diffusion

• Lithography

• Deposition

How does X-Ray Fluorescence (XRF) work for identifying hazardous substances in electronic products?

• By emitting X-rays to measure the resistance of materials

• By analyzing the reflection of infrared radiation

• By exciting atoms in the sample, causing them to emit characteristic X-rays

• By measuring the absorption of ultraviolet light

Which of the following hazardous substances can be detected using X-Ray Fluorescence (XRF) in electronic products?

• Lead (Pb)

• Carbon (C)

• Silicon (Si)

• Copper (Cu)

Which process is typically used to recycle thermoplastics?

• Incineration

• Mechanical recycling

• Chemical degradation

• Landfill disposal

Which of the following is a characteristic of recyclable materials suitable for substitution?

• Non-biodegradable nature

• High thermal stability

• Low cost

• Incompatibility with other materials