PGTs & GETs QUIZ TEST

What is the main objective of wafer probe testing in semiconductor testing?

• To inspect the visual appearance of the wafer
• To test the electrical functionality of the semiconductor die on the wafer
• To clean the wafer surface
• To enhance the mechanical strength of the wafer

In semiconductor testing, what does the term "burn-in" refer to?

• A process to stress test the semiconductor device to identify early failures
• A method for packaging the semiconductor device
• A technique for enhancing the die size
• A process to reduce the thermal resistance of the package

What is the primary purpose of Automated Test Equipment (ATE) in an OSAT plant?

• To automate the process of testing semiconductor devices for performance and defects
• To handle and package semiconductor devices
• To improve the visual inspection of semiconductor devices
• To enhance the mechanical properties of the semiconductor package

Which of the following is NOT typically a parameter measured during semiconductor testing?

• Electrical performance
• Thermal characteristics
• Visual appearance
• Signal integrity

What is the main advantage of using in-circuit testing (ICT) over functional testing?

• Allows for testing of individual components within the circuit for defects
• Provides a more comprehensive test of the final product
• Requires less time than other testing methods
• Reduces the overall cost of testing

In the context of semiconductor testing, what does the term "test coverage" refer to?

• The extent to which a test plan examines the functionality and reliability of the device
• The physical area covered by the testing equipment
• The number of devices tested in a batch
• The visual coverage of the semiconductor die

What type of testing is performed to ensure a semiconductor device functions correctly in its final application environment?

• Electrical characterization
• System-level testing
• Reliability testing
• Environmental stress screening

What is the main purpose of a test socket in semiconductor testing?

• To establish electrical connections between the test equipment and the device
• To enhance the thermal dissipation of the device
• To provide mechanical support for the device
• To increase the packaging density

Which of the following is a common challenge faced during high-speed signal testing?

• Signal integrity issues due to crosstalk and interference
• Inadequate mechanical support for the test equipment
• Excessive cost of testing equipment
• Low test coverage of the device

What does "failure analysis" involve in semiconductor testing?

• Investigating and diagnosing the root cause of failures in semiconductor devices
• Testing the overall performance of the semiconductor device
• Evaluating the visual defects in the semiconductor package
• Measuring the thermal performance of the device