Apakah prosedur pemisahan bahagian elektronik rosak menggunakan peranti desoldering vakum?
PENGASINGAN KEROSAKAN KOMPONEN ELEKTRONIK
Quiz
•
Engineering
•
2nd Grade
•
Easy
ASHIRATUL KPM-Guru
Used 1+ times
FREE Resource
28 questions
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1.
OPEN ENDED QUESTION
3 mins • 1 pt
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2.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah kaedah jalinan yang digunakan untuk penyediaan pad pelekap permukaan?
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3.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah penting untuk mengelakkan meletakkan tekanan ke bawah atau sisi pad pada keringan apabila menggunakan haba?
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4.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah kaedah peranti yang digunakan untuk penyediaan Pad Pelekap Permukaan?
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5.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur yang termasuk dalam Soldering Surface Mount Chip Components, Point-To-Point Method?
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6.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur untuk menukar komponen pada papan litar tercetak?
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7.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur penandaan bahagian elektronik rosak pada PCB?
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OFF
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