Cross Section

What is the primary purpose of cross-sectioning in failure analysis?

• To test IC function

• To observe internal layers

• To remove packaging

• To test electrical connectivity

Which material is commonly used for encapsulation before cross-sectioning?

• Silicon

• Aluminum

• Acrylic resin

• Gold

Encapsulation is necessary before cross-sectioning to stabilize small samples

• True

• False

Which failure type is best observed with cross-sectioning?

• Lithography alignment errors

• Particle defects on die surface

• Surface contamination

• Delamination between layers

Which of the following is NOT typically a cause for cross-sectioning defects?

• Improper polishing

• Uneven grinding

• Accurate layer removal

• Over-etching

Which tool is commonly used to inspect cross-sectioned samples?

• Wire bonder

• SEM

• UV tester

• Wet etcher

What happens if curing time is insufficient during encapsulation?

• Harder material forms

• Sample overheats

• Cross-section is mirror-finished

• Surface stays soft and unstable

Which of the following is a mechanical preparation step before inspection?

• Grinding and polishing

• Sputter coating

• Etching

• SEM imaging

Delamination can occur between metal layers in IC packages.

• True

• False

Which defect may result from electromigration?

• Misalignment of patterns

• Contamination residues

• Voids in metal lines

• Corrosion pits