Wayground logo

Free Printable Worksheets

Font size

S
M
L
XL
Worksheets

Chiplet Introduction

Total questions: 8

Worksheet time: 3mins

Name
Class
Date
1.

What is ranking of Taiwan in semiconductor market size ?

a)

1

b)

2

c)

3

d)

4

2.

Which one is not benefit of advanced process that we want ?

a)

Denser transistor density

b)

Higher yield

c)

Lower voltage supplied

d)

More power dissipation

3.

Which one is not challenge of chiplet ?

a)

IO SI and PI

b)

Subtract cost

c)

EDA tools integration

d)

Thermal management

4.

Which one is not important technology of chiplet ?

a)

Interconnect interface

b)

TSV

c)

Si interposer

d)

Wire bonding

5.

What is FOWLP we mentioned in packaging technology ?

a)

Flat Of Water Level Proof

b)

First OWL Pokemon

c)

Fan Out Wafer Level Package

d)

Forecast Of West Located Paddy

6.

Which one is not benefit of chiplet ?

a)

Time to market

b)

Compose with different node die

c)

Mask level enlarged

d)

Reusable die

7.

Which interconnect protocol is license free ?

a)

Intel AIB

b)

Intel MDIO

c)

TSMC Lipincon

d)

Candence Ultralink

8.

Which one dominates static current leakage in advanced nanometer process ?

a)

Junction fevers bias leakage

b)

Sub-threshold leakage

c)

Gate leakage (Direct tunneling)

d)

Gate induced drain leakage