wayground logo

Free Printable Worksheets

NEW

Font size

S
M
L
XL
Worksheets

PE Unit 1

Total questions: 15

Worksheet time: 8mins

Name
Class
Date
1.

Power diode is

a)

a three terminal semiconductor device

b)

a two terminal semiconductor device

c)

a four terminal semiconductor device

d)

a three terminal analog device

2.

The V-I Characteristics of the diode lie in the

a)

1st & 2nd quadrant

b)

1st & 4th quadrant

c)

1st & 3rd quadrant

d)

Only in the 1st quadrant

3.

Choose the false statement

a)

SCR is a bidirectional device

b)

SCR is a controlled device

c)

In SCR the gate is the controlling terminal

d)

SCR are used for high-power applications

4.

Among the following, the most suitable method to turn on the SCR device is the

a)

Gate triggering method

b)

dv/dt triggering method

c)

Forward voltage triggering method

d)

Temperature triggering method

5.

The forward break over voltage is maximum when

a)

Gate current = ∞

b)

Gate current = -∞

c)

It is independent of gate current

d)

Gate current = 0

6.

Higher the magnitude of the gate pulse

a)

Lesser is the time required to inject the charges

b)

Greater is the time required to inject the charges

c)

Greater is the value of anode current

d)

Lesser is the value of anode current

7.

Choose the correct statement

a)

MOSFET is a uncontrolled device

b)

MOSFET is a voltage controlled device

c)

MOSFET is a current controlled device

d)

MOSFET is a temperature controlled device

8.

The controlling parameter in MOSFET is

a)

Vds

b)

Ig

c)

Vgs

d)

Is

9.

At turn-on the initial delay or turn on delay is the time required for the

a)

Input inductance to charge to the threshold value

b)

Input inductance to discharge to the threshold value

c)

Input capacitance to discharge to the threshold value

d)

Input capacitance to charge to the threshold value

10.

In an IGBT, during the turn-on time

a)

Vge decreases

b)

Ic decreases

c)

Vce decreases

d)

none of the mentioned

11.

An IGBT is also know as

a)

MOIGT (Metal oxide insulated gate transistor)

b)

COMFET (Conductively modulated FET)

c)

GEMFET (Grain modulated FET)

d)

All of the mentioned

12.

The semiconductor device used in bidirectional application

a)

GTO

b)

SCR

c)

MOSFET

d)

TRIAC

13.

Identify the symbol of semiconductor device

a)

GTO

b)

SCR

c)

TRIAC

d)

IGBT

14.

Snubber circuit is used for

a)

Temperature protection

b)

Overvoltage protection

c)

Overcurrent protection

d)

Both overvoltage and overcurrent protection

15.

IGBT can be used for

a)

20 to 50 kHz

b)

Less than 10 kHz

c)

More than 50 kHz

d)

50 to 100 kHz