NEW
Font size
WorksheetsESS553 Midterm Review
Total questions: 10
Worksheet time: 5mins
For the given initial and boundary conditions, which method should you use to calculate the concentration profile?
Thin-Film Solution
Error Function Solution
Fourier Series Solution
Laplace Transform Method
For a Cu-Sn diffusion couple, which side will you expect to see the Kirkendall voids? (Tm,Cu = 1085oC, Tm,Sn = 232oC)
Cu-rich side
Sn-rich side
Both sides
The dark side
Under which of the following conditions will high diffusivity paths (快速擴散路徑) dominate the diffusion process?
Low defect density (低缺陷密度)
High temperature (高溫)
Low temperature (低溫)
Short diffusion time (短時間)
From the atomic model of diffusion and random walk theory, the root-mean-squared displacement of an atom in 3D is?
2Dt
4Dt
6Dt
8Dt
If a material process operates through serial (串聯) reactions, which reaction will dominate the reaction rate?
The slowest (最慢) reaction
The fastest (最快) reaction
The coolest (最酷) reaction
The hottest (最辣) reaction
When calculating interdiffusivity, the diffusivity of the element with a lower concentration will contribute more to the calculated value.
True
False
Given the melting temperature (熔點) below, which element, at the same temperature, should have the slowest (最慢) self-diffusion rate?
Cu (1083oC)
Ag (961oC)
Al (660oC)
Ni (1455oC)
For a drive-in doping process (thin-film solution), under what condition will the solution error be less than 0.1%?
L>4.6 Dt
L<4.6 Dt
L=4.6 Dt
L<3.7 Dt
If two elements do not like to mix with each other, how is the thermodynamic factor compared to 1?
Higher than 1
Lower than 1
Equal to 1
Faster than 1
Which process should result in the shown carbon (C) concentration profile?
Carburization (滲碳)
Decarburization (脫碳)
Carbon deposition (積碳)
