WorksheetsHigh Speed PCB
Total questions: 10
Worksheet time: 13mins
Pick C as answer
A
B
C
D
Non of the above
Which of the statements is true
Incident current and return current cancel each other
High speed board has signals with high operating frequency and high rise/fall time
Insufficient decoupling power system is not affecting SI quality
Non of the above
In series termination, where the resistor being placed?
Receiver side
Driver side
Power side
Upper side
How to reduce EMI problem
GND via placed far from the transitioning via when traces changes layer
Maintain continuous reference plane
Not maintaining trace impedance
Among the methods of controlling the EMI below, which 3 will be the widely used in our design?
i. Minimise loop area(H)
ii. Use stripline to route signal
iii. Use Ground guard for high speed routing
iV. 20H rules
i, ii, iv
i, ii, iii
ii, iii, iv
Which of the stackup criteria below caused surge/increase transmission line impedances?
i. Lower copper ounces(T)
ii. Smaller trace width(W)
iii. Thicker prepeg distance from the adjacent reference layer(H, H1)
iv. Smaller dielectric constant (Er)
i, ii, iii
i, ii, iv
ii, iii, iv
All of the above
What will be the most accurate reason for using fiber weave routing in PCB high speed designs?
To reduce the EMI interferences from adjacent signals and to reduce the impact of crosstalk.
To reduce the impact of impedance mismatched caused by the Dk and Df variation from fiberglass pattern.
What techniques can we use ensure constant differential impedance between the close separated portion and far separated portion as in the image below:
i. Reduce the trace width of the far separated portion
ii. Create voids under the connector pads
iii. Reduce the far separated portion by routing the traces closer by bending them inwards
iv. Increase the trace width of the far separated portion
i, ii, iii
i, ii, iv
ii, iii, iv
All of the above
Which of the following will help to minimize crosstalk?
Keep parallel coupled length as short as possible
Make Stack up route trace as close as possible to Ref plane, H
Avoid disturbance of the signal return path
All of the statement
Using configurable IC to set the slew rate (i) and set the drive strength (ii) helps to reduce ground bounce.
i. Faster
ii. Stronger
i. Faster
ii. Weaker
i. Slower
ii. Stronger
i. Slower
ii. Weaker
