WorksheetsCOA-midterm prep
Total questions: 93
Worksheet time: 49mins
Electrostatic discharge (ESD)
can occur when there is a buildup of static electricity that exists on a surface which comes into contact with another, differently charged surface.
this form factor is often used for home theater PCs (HTPCs).
Called a mini-tower or small form factor (SFF) model. Commonly found in the corporate environment.
All of the computer system components are integrated into the display.
Type 1 (native) hypervisor
This is hosted by an OS and is commonly used with client-side virtualization. It needs OS to run on computer.
bare-metal hypervisor and typically used with server virtualization. It runs directly on the hardware of a host and manages the allocation of system resources to virtual operating systems.
enables a single computer to host multiple independent virtual computers that share the host computer hardware.
has its own OS and connect to hardware resources through software running on the host computer.
Type 2 (hosted) hypervisor
enables a single computer to host multiple independent virtual computers that share the host computer hardware.
This is hosted by an OS and is commonly used with client-side virtualization. It needs OS to run on computer.
has its own OS and connect to hardware resources through software running on the host computer.
bare-metal hypervisor and typically used with server virtualization. It runs directly on the hardware of a host and manages the allocation of system resources to virtual operating systems.
Virtualization
enables a single computer to host multiple independent virtual computers that share the host computer hardware.
has its own OS and connect to hardware resources through software running on the host computer.
This is hosted by an OS and is commonly used with client-side virtualization. It needs OS to run on computer.
bare-metal hypervisor and typically used with server virtualization. It runs directly on the hardware of a host and manages the allocation of system resources to virtual operating systems.
Instructions to prevent ESD:
Keep all components in antistatic bags until you are ready to install them.
Use grounded mats on workbenches.
Use grounded floor mats in work areas.
Original power supply for legacy computer systems, now considered old.
30 V
needed at least, so a person can feel ESD.
can damage a computer component.
if discharge causes pain or makes a noise.
Use antistatic wrist straps when working inside computers.
3,000 V
if discharge causes pain or makes a noise.
can damage a computer component.
Use grounded mats on workbenches.
needed at least, so a person can feel ESD.
Horizontal case
this form factor is often used for home theater PCs (HTPCs).
vertically-oriented case, typically located on the floor under, or beside, a desk or table.
Called a mini-tower or small form factor (SFF) model. Commonly found in the corporate environment.
All of the computer system components are integrated into the display.
Full-size tower
this form factor is often used for home theater PCs (HTPCs).
vertically-oriented case, typically located on the floor under, or beside, a desk or table.
Called a mini-tower or small form factor (SFF) model. Commonly found in the corporate environment.
All of the computer system components are integrated into the display.
Compact tower
Called a mini-tower or small form factor (SFF) model. Commonly found in the corporate environment.
this form factor is often used for home theater PCs (HTPCs).
vertically-oriented case, typically located on the floor under, or beside, a desk or table.
All of the computer system components are integrated into the display.
Advanced Technology (AT)
Updated version of the AT, also considered old.
Most common power supply. It includes a second motherboard connector to provide dedicated power to the CPU
Originally designed for network servers, but, now commonly used in high-end desktop models.
Original power supply for legacy computer systems, now considered old.
AT Extended (ATX)
Updated version of the AT, also considered old.
Originally designed for network servers, but, now commonly used in high-end desktop models.
All of the computer system components are integrated into the display.
The most common voltages are - 3.3V, 5V, 12V.
ATX12V
Original power supply for legacy computer systems, now considered old.
Updated version of the AT, also considered old.
Most common power supply. It includes a second motherboard connector to provide dedicated power to the CPU.
Originally designed for network servers, but, now commonly used in high-end desktop models.
EPS12V
Original power supply for legacy computer systems, now considered old.
Originally designed for network servers, but, now commonly used in high-end desktop models.
Most common power supply. It includes a second motherboard connector to provide dedicated power to the CPU.
Updated version of the AT, also considered old.
The most common voltages are
3.3V
5V
12V.
6V
supplies are typically used by digital circuits
12V
5V
2.3V
3.3V
12V supply
used by digital circuits.
to run motors in disk drives and fans.
commonly used in high-end desktop models.
It includes a second motherboard connector to provide dedicated power to the CPU.
A 20-pin or 24-pin slotted connector:
Connects disk drives;
Connects to the motherboard;
Connects hard drives, optical drives, or other devices;
Connect to legacy floppy drives;
SATA
a disk drive interface used for connecting optical drives, hard drives, and solid-state drives to the motherboard
Connects disk drives;
Connects hard drives, optical drives, or other devices;
Smaller than a Molex connector;
Molex:
Connects hard drives, optical drives, or other devices;
20-pin connector has two rows of 10 pins each;
Connector is wider and thinner than a Molex connector
Connector has two rows of three to four pins and supplies power to internal components
Berg:
Connects hard drives, optical drives, or other devices;
Connect to legacy floppy drives;
Smaller than a Molex connector;
Connector has two rows of two to four pins and supplies power to different areas of the motherboard;
Connects to the motherboard;
4-pin to 8-pin auxiliary power connector:
Connects hard drives, optical drives, or other devices;
Connect to legacy floppy drives;
Connects disk drives;
Connector has two rows of two to four pins and supplies power to different areas of the motherboard;
6/8-pin PCIe power connector:
Smaller than a Molex connector;
24-pin connector has two rows of 12 pins each;
20-pin connector has two rows of 10 pins each;
Connector has two rows of three to four pins and supplies power to internal components
Connector has two rows of two to four pins and supplies power to different areas of the motherboard;
Motherboard types:
Advanced Technology eXtended (ATX)
Micro-ATX
Mini-ITX
Mini-ATX
The most common motherboard form factor. The ATX power supply connects to the motherboard via a single 20-pin connector.
Advanced Technology eXtended (ATX)
Micro-ATX
Mini-ITX
Micro-ATX
Popular because of its very small size. Its form factor uses very little power, so fans are not needed to keep it cool.
The most common motherboard form factor. The ATX power supply connects to the motherboard via a single 20-pin connector.
Smaller form factor that is designed to be backward-compatible with ATX. Micro-ATX motherboards are much smaller than ATX motherboards and have fewer expansion slots.
Mini-ITX
The most common motherboard form factor. The ATX power supply connects to the motherboard via a single 20-pin connector.
Popular because of its very small size. Its form factor uses very little power, so fans are not needed to keep it cool.
Smaller form factor that is designed to be backward-compatible with ATX. Micro-ATX motherboards are much smaller than ATX motherboards and have fewer expansion slots.
CPU Types:
PGA
RISC
LGA
CISC
the pins are on the underside of the CPU and is inserted into socket using zero insertion force (ZIF).
PGA
LGA
CPU
LGA
the pins are in the socket instead of on the CPU.
the pins are on the underside of the CPU and is inserted into socket using zero insertion force (ZIF).
Very fast. Uses a small set of instructions.
Slow
Passive Cooling
Heat Sink
Case Fan
Active Cooling
Heat Sink
Case Fan
ROM (Read-Only Memory)
temporary working storage for data and programs that are being accessed by the CPU.
can only be programmed once.
The instructions stored in ROM include basic operation instructions such as booting the computer and loading the operating system. Non-volatile.
data can be electrically erased, often used to store BIOS.
RAM (Random Access Memory)
temporary working storage for data and programs that are being accessed by the CPU.
The instructions stored in ROM include basic operation instructions such as booting the computer and loading the operating system. Non-volatile.
ROM Types:
PROM - can only be programmed once.
EPROM - data can be erased by exposing to strong ultraviolet light.
EEPROM - data can be electrically erased, often used to store BIOS.
DRAM (Dynamic)- old technology.
EEPROM -
data can be electrically erased, often used to store BIOS.
can only be programmed once.
data can be erased by exposing to strong ultraviolet light
184 pin connector, uses 2.5V
240 pin connector, uses 1.5V
DDR2 SDRAM
DDR3 SDRAM
DDR4 SDRAM
DDR5 SDRAM
DDR4 SDRAM
special RAM for Graphics
184 pin connector, uses 2.5V
288 pin connector, uses 1.2V
240 pin connector, uses 1.5V
DIP
is individual memory chip. DIP has dual rows of pins.
is small circuit board that holds several memory chips. Has 30-pin or 72-pin configurations.
is circuit board that holds SDRAM, DDR 1,2,3,4,5 chips.
smaller DIMM. Used in laptops, printers, and other
SIMM
is circuit board that holds SDRAM, DDR 1,2,3,4,5 chips.
168-pin, 184-pin, 240-pin, and 288-pin.
is individual memory chip. DIP has dual rows of pins.
small circuit board that holds several memory chips. Has 30-pin or 72-pin configurations.
smaller DIMM. Used in laptops, printers, and other.
144-pin, 200-pin, 204-pin, and 260-pin.
DIMM is
circuit board that holds SDRAM, DDR 1,2,3,4,5 chips.
168-pin, 184-pin, 240-pin, and 288-pin.
smaller DIMM. Used in laptops, printers, and other.
144-pin, 200-pin, 204-pin, and 260-pin.
-------------------------------------------
is individual memory chip. DIP has dual rows of pins.
is small circuit board that holds several memory chips. Has 30-pin or 72-pin configurations.
SO-DIMM
is individual memory chip. DIP has dual rows of pins.
is small circuit board that holds several memory chips. Has 30-pin or 72-pin configurations.
is circuit board that holds SDRAM, DDR 1,2,3,4,5 chips.
168-pin, 184-pin, 240-pin, and 288-pin.
smaller DIMM. Used in laptops, printers, and other.
144-pin, 200-pin, 204-pin, and 260-pin.
Cache Memory Types:
L1
L2
L3
L4
L1 cache is
internal cashe
external cashe
L2 cache is
external
internal
is used on some high-end workstations and server CPUs.
L3 cache is
used on some high-end workstations and server CPUs.
internal cache.
external cache.
Secure digital (SD)
Much smaller version of SD. Used in smartphones and tablets.
used in cameras, MP3 players, and laptops. SD cards can hold as much as 2 TB of data.
A version between SD and microSD card. Used for mobile phones.
Older format, but still in use because of its high speed and high capacity. It is used as storage for video cameras.
MicroSD
Much smaller version of SD. Used in smartphones and tablets.
was used in some digital cameras.
Sony flash memory used in cameras, MP3 players, hand-held video game systems, mobile phones, cameras, and other portable electronics.
Older format, but still in use because of its high speed and high capacity. It is used as storage for video cameras.
MiniSD
used in cameras, MP3 players, and laptops. SD cards can hold as much as 2 TB of data.
A version between SD and microSD card. Used for mobile phones.
Much smaller version of SD. Used in smartphones and tablets.
Sony flash memory used in cameras, MP3 players, hand-held video game systems, mobile phones, cameras, and other portable electronics.
CompactFlash
Much smaller version of SD. Used in smartphones and tablets.
was used in some digital cameras.
Older format, but still in use because of its high speed and high capacity. It is used as storage for video cameras.
used in cameras, MP3 players, and laptops. SD cards can hold as much as 2 TB of data.
Memory Stick
Sony flash memory used in cameras, MP3 players, hand-held video game systems, mobile phones, cameras, and other portable electronics.
was used in some digital cameras.
Much smaller version of SD. Used in smartphones and tablets.
Older format, but still in use because of its high speed and high capacity. It is used as storage for video cameras.
Picture Card (xD)
was used in some digital cameras.
A version between SD and microSD card. Used for mobile phones.
Sony flash memory used in cameras, MP3 players, hand-held video game systems, mobile phones, cameras, and other portable electronics.
Much smaller version of SD. Used in smartphones and tablets.
Media Card Types:
Secure digital (SD)
MicroSD
MiniSD
CompactFlash
Memory Stick
BIOS
provides additional features and security to legacy BIOS.
all motherboards need it to operate. BIOS is a ROM chip on the motherboard that contains a small program.
is a process when a computer is booted, and BIOS performs a hardware check on the main components of the computer.
hard drive can be encrypted to prevent data theft.
Secure boot
UEFI security standard.
hard drive can be encrypted to prevent data theft.
security feature that consists of two programs; the Persistence Module and the Application Agent. Locates, Locks and Deletes data.
chip designed to secure hardware by storing encryption keys, digital certificates, passwords, and data.
UEFI
security feature that consists of two programs; the Persistence Module and the Application Agent. Locates, Locks and Deletes data.
provides additional features and security to legacy BIOS.
is a process when a computer is booted, and BIOS performs a hardware check on the main components of the computer.
POST
provides additional features and security to legacy BIOS.
UEFI security standard.
is a process when a computer is booted, and BIOS performs a hardware check on the main components of the computer
hard drive can be encrypted to prevent data theft.
Drive encryption
UEFI security standard.
hard drive can be encrypted to prevent data theft.
security feature that consists of two programs; the Persistence Module and the Application Agent. Locates, Locks and Deletes data.
chip designed to secure hardware by storing encryption keys, digital certificates, passwords, and data.
LoJack – security feature that consists of two programs; the Persistence Module and the Application Agent. Locates, Locks and Deletes data.
True
False
TPM
chip designed to secure hardware by storing encryption keys, digital certificates, passwords, and data.
security feature that consists of two programs; the Persistence Module and the Application Agent. Locates, Locks and Deletes data.
Ohm's Law: V = I/R
False
True
Power: P = VI
True
False
Public Cloud
made up of two or more clouds where each part remains a distinctive object, but both are connected using a single architecture
Cloud-based applications and services are made available to the general population.
Cloud-based applications and services offered are for a specific organization or entity, such as the government.
Hybrid Cloud
Cloud-based applications and services offered are for a specific organization or entity, such as the government.
made up of two or more clouds where each part remains a distinctive object, but both are connected using a single architecture.
Cloud-based applications and services are made available to the general population.
Private Cloud
Cloud-based applications and services offered are for a specific organization or entity, such as the government.
made up of two or more clouds where each part remains a distinctive object, but both are connected using a single architecture.
Cloud-based applications and services are made available to the general population.
Software as a Service (SaaS)
access to services, such as email, calendar, communication, and office tools over the Internet on a subscription basis.
access to operating systems, development tools, programming languages, and libraries used to develop, test, and deliver applications.
provider manages the network and provides organizations access to network equipment, virtualized network services, storage, software, and supporting network infrastructure.
Platform as a Service (PaaS)
access to operating systems, development tools, programming languages, and libraries used to develop, test, and deliver applications.
provider manages the network and provides organizations access to network equipment, virtualized network services, storage, software, and supporting network infrastructure.
access to services, such as email, calendar, communication, and office tools over the Internet on a subscription basis.
Infrastructure as a Service (IaaS)
access to operating systems, development tools, programming languages, and libraries used to develop, test, and deliver applications.
provider manages the network and provides organizations access to network equipment, virtualized network services, storage, software, and supporting network infrastructure.
access to services, such as email, calendar, communication, and office tools over the Internet on a subscription basis.
Virtual Machine
has its own OS and connect to hardware resources through software running on the host computer.
enables a single computer to host multiple independent virtual computers that share the host computer hardware.
This is hosted by an OS and is commonly used with client-side virtualization. It needs OS to run on computer.
bare-metal hypervisor and typically used with server virtualization. It runs directly on the hardware of a host and manages the allocation of system resources to virtual operating systems.
Thermal printer
heated areas of the print head make the image on the special paper, there is no cost for ink or toner.
used to create three-dimensional objects, that are first designed using a computer:
images and text are drawnout of small dots when aprint head hits an ink cloth against the paper.
recreates a digitalimage by sprayingink onto paper.
3D printers - used to create three-dimensional objects, that are first designed using a computer
True
False
Blackout
Complete loss of AC power.
Reduced voltage level of AC power.
Interference from generators and lightning.
Sudden increase in voltage that lasts for less than 3 nanoseconds.
Brownout
Reduced voltage level of AC power.
Complete loss of AC power.
Dramatic increase in voltage above the normal flow. Lasts more than 3 nanoseconds.
Sudden increase in voltage that lasts for less than 3 nanoseconds.
Spike
Sudden increase in voltage that lasts for less than 3 nanoseconds.
Dramatic increase in voltage above the normal flow. Lasts more than 3 nanoseconds.
Reduced voltage level of AC power.
Complete loss of AC power.
Power surge
Sudden increase in voltage that lasts for less than 3 nanoseconds.
Dramatic increase in voltage above the normal flow. Lasts more than 3 nanoseconds.
Reduced voltage level of AC power.
Complete loss of AC power.
Power Protection Devices:
Surge protector
Uninterruptible power supply (UPS)
Standby power supply (SPS)
Overclocking
Surge protector (Сетевой фильтр)
Helps protect against damage from surges and spikes.
supplies a consistent level of electrical power.
backup battery.
Uninterruptible power supply (UPS)
Helps protect against damage from surges and spikes.
supplies a consistent level of electrical power.
backup battery.
Standby power supply (SPS)
backup battery.
supplies a consistent level of electrical power.
Helps protect against damage from surges and spikes.
Overclocking (Разгон Процессора)
technique used when the processor runs slower.
technique used to make a processor work at a faster speed than its original specification.
when multiple pieces of code are executed simultaneously.
HyperTransport (AMD) - when CPU and Northbridge chip have high-speed connection.
Throttling
technique used when the processor runs slower.
when multiple pieces of code are executed simultaneously.
when CPU and Northbridge chip have high-speed connection.
feature supported by AMD and Intel CPUs, it enables a single processor to act as multiple processors.
Hyper-Threading (Intel)
when multiple pieces of code are executed simultaneously.
when CPU and Northbridge chip have high-speed connection.
feature supported by AMD and Intel CPUs, it enables a single processor to act as multiple processors.
technique used when the processor runs slower.
HyperTransport (AMD)
when CPU and Northbridge chip have high-speed connection.
feature supported by AMD and Intel CPUs, it enables a single processor to act as multiple processors.
technique used to make a processor work at a faster speed than its original specification.
CPU virtualization
feature supported by AMD and Intel CPUs, it enables a single processor to act as multiple processors.
when multiple pieces of code are executed simultaneously.
when CPU and Northbridge chip have high-speed connection.
technique used to make a processor work at a faster speed than its original specification.
RAID (redundant array of independent disks)
provides a way to store data across multiple storage devices for availability, reliability, capacity, and redundancy
feature supported by AMD and Intel CPUs, it enables a single processor to act as multiple processors.
enables data to be distributed across multiple drives. This provides a significant performance increase.
technique used to make a processor work at a faster speed than its original specification.
Striping
enables data to be distributed across multiple drives. This provides a significant performance increase.
duplicates data on one or more other drives. duplicates data on one or more other drives.
provides basic error checking.
provides fault tolerance up to two failed drives.
Mirroring
duplicates data on one or more other drives.
provides basic error checking.
provides fault tolerance up to two failed drives.
enables data to be distributed across multiple drives. This provides a significant performance increase.
Parity
provides basic error checking.
provides fault tolerance up to two failed drives.
enables data to be distributed across multiple drives. This provides a significant performance increase.
Double Parity
provides fault tolerance up to two failed drives.
duplicates data on one or more other drives.
provides basic error checking.
enables data to be distributed across multiple drives. This provides a significant performance increase.
RAID LEVEL 0 :
Striping, Minimum number of drives - 2
Mirroring, Minimum number of drives - 2
Striping with parity, Minimum number of drives - 3
Striping with double parity, Minimum number of drives - 4
RAID LEVEL 1 :
Mirroring, Minimum number of drives - 2
Striping with double parity, Minimum number of drives - 4
Striping with parity, Minimum number of drives - 3
Mirroring and Striping, Minimum number of drives - 4
RAID LEVEL 10:
Mirroring and Striping, Minimum number of drives - 4
Striping with double parity, Minimum number of drives - 4
Mirroring, Minimum number of drives - 2
Striping, Minimum number of drives - 2
RAID LEVEL 6 :
Striping with double parity, Minimum number of drives - 4
Mirroring and Striping, Minimum number of drives - 4
Striping with parity, Minimum number of drives - 3
Mirroring, Minimum number of drives - 2
