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Introduction to Digital IC

Total questions: 69

Worksheet time: 12mins

Name
Class
Date
1.

Which company invented the first microprocessor in 1971?

a)

Microsoft

b)

Apple

c)

Intel

d)

Texas Instruments

2.

Identify this computer component:

a)

Transistor

b)

Integrated Circuit (IC)

c)

Microprocessor

d)

Vacuum Tube

3.

It was the first microprocessor introduced by Intel Corporation.

a)

4004 Chip

b)

CPU

c)

Microprocessor

4.

In MOS transistors, _____ is used for their gate

a)

Metal

b)

Silicon di Oxide

c)

Source/Drain

d)

Polysilicon

5.

Source in nMOS transistors is doped with ______ material

a)

p-type

b)

n-type

c)

both n and p-type

d)

Neither n or p-type

6.

During the fabrication process the photoresist layer is exposed to

a)

visible light

b)

ultraviolet light

c)

infra red light

d)

LED

7.

The condition for linear region is

a)

Vgs lesser than Vt

b)

Vgs greater than Vt

c)

Vds lesser than Vgs

d)

Vds greater than Vgs

8.

What is the channel length modulation effect?

a)

Ids decreases with Vds

b)

Ids increases with Vds

c)

Ids is constant with increasing Vds

9.

Which type of technology has a higher cost per piece?

a)

FPGA

b)

ASIC

c)

Custom ASIC

10.

Intel currently has a CMOS technology process in which λ \lambda\  = 11 nm. What is the minimum size of the transistor?

a)

11 nm

b)

22 nm

c)

33 nm

d)

44 nm

11.

What are the advantages of Moore's Law?

a)

More functions can be integrated on single chip

b)

Cost decreases by 2x

c)

Transistors can switch at a faster rate

d)

Chips have lower temperatures

12.

What are the advantages of smaller transistor sizes?

a)

Lower cost

b)

More transistors per unit area

c)

Faster switching speeds

d)

Higher current

e)

Higher gate voltage

13.

Which model is used for scaling?

a)

constant electric scaling

b)

constant voltage scaling

c)

constant electric and voltage scaling

d)

constant current model

14.

Regularity is the ratio of

a)

total transistors in the chip to total transistors that must be designed in detail

b)

total transistors that must be designed in detail to total transistors in chip

c)

total transistors to total components

d)

total charge storage components to charge dissipating components

15.

In the graph, the regions marked as A,B,C are

a)

A : Saturation, B : Linear, C : Cut-off

b)

A :Cut-off, B : Linear, C : Saturation

c)

A : Linear, B : Saturation, C : Cut-off

d)

None of the mentioned

16.

How is nMOS depletion mode transistor represented?

a)
b)
c)
d)
17.

Which model is used for scaling?

a)

a) constant electric scaling

b)

b) constant voltage scaling

c)

c) constant electric and voltage scaling

d)

d) constant current model

18.

The ______ is used to reduce the resistivity of poly silicon.


a)

a) Photo resist

b)

b) Etching

c)

c) Doping impurities

d)

d) None of the mentioned

19.

Which color is used for n-diffusion in stick diagram?


a)

a) red

b)

b) blue

c)

c) green

d)

d) yellow

20.

The output F of the shown 4 to 1 Multiplexer is

a)

XY‾X\overline{Y}

b)

X‾+Y‾\overline{X}+\overline{Y}

c)

X+YX+Y

d)

XYXY

21.

The NMOS circuit chain shown in the figure can act as a

a)

Buffer

b)

NAND Gate

c)

NOR Gate

d)

Invertor

22.

The fastest logic family is

a)

CMOS

b)

NMOS

c)

TTL

d)

ECL

23.

Supply voltage of a CMOS circuit is doubled. Its dynamic power dissipation will

a)

not change

b)

be doubled

c)

be halved

d)

increase by 4 times

24.

Silicon oxide is patterned on a substrate using:

a)

Physical lithography

b)

Chemical lithography

c)

photolithography

d)

none of these

25.

As channel length becomes smaller

a)

a. Longitudinal electric field component Ey reduces

b)

b. Longitudinal electric field component Ey remains same

c)

c. Longitudinal electric field component Ey increases

d)

d. None of the above

26.

When the MOSFET is in depletion mode, the MOS capacitance is

a)

a. Oxide capacitance

b)

b. Depletion layer capacitance

c)

c. Series combination of oxide capacitance and depletion layer capacitance

d)

d. Parallel combination of oxide capacitance and depletion layer capacitance

27.

The VLSI design flow starts with:

a)

RTL synthesis

b)

Product specifications

c)

Library mapping

28.

What is the purpose of function verification?

a)

for debugging

b)

prove the structural netlist perform the same function as the original behavior HDL

c)

to check the speed performance

29.

What is design flow?

a)

A set of procedure that allows designers to progress from a specification for a chip to the final chip implementation in an error-free way

b)

A set of procedure that allows designers to progress from a specification for a chip to the final chip implementation in an error way

30.

The active components in an ICs are

a)

Resistors

b)

capacitors

c)

Diodes and transistors

d)

None of above

31.

In Very large scale Integration VLSI,No of components integrated on same chip are

a)

less than 100

b)

more than 100

c)

more than 1000

d)

less than 1000

32.

What is the Logic Expression for this circuit?

a)

Z = NOT (A AND B)

b)

Z = NOT (A OR B)

c)

Z = (NOT A) AND B

d)

Z = (NOT A) OR B

33.

What is the output Y of this logic cricuit if A = 1, B = 1, and C = 1

a)

0

b)

1

34.

Which logic gate is represented by this truth table?

a)
b)
c)
d)
35.

By making them practical, who is widely regarded as the father of modern ICs?

a)

Jack Kilby

b)

Robert Noyce

c)

Sherman Fairchild

d)

Gordon Moore

36.

The starting material for making integrated circuits is a slice of silicon called ___

a)

a cookie

b)

a wafer

c)

a biscuit

d)

a cracker

37.

Which type of layer is added on top of the silicon to act as a protective coating?

a)

a thin oxide layer

b)

a photoresist

c)

a photo mask

d)

phosphorus

38.

Which layer, when exposed to light, becomes soluble so it can be washed away?

a)

a thin oxide layer

b)

a photoresist

c)

a photo mask

d)

phosphorus

39.

Which process uses a high temperature gas, like phosphorus, to change the conductivity of silicon?

a)

doping

b)

debasing

c)

injection molding

d)

narcotizing

40.

Which process deposits a thin layer of metal, like aluminum or copper, onto the wafer?

a)

doping

b)

oxide lithography

c)

etching

d)

metalization

41.

We can focus a ______ onto a very small patch of silicon, creating incredibly fine details

a)

thin oxide layer

b)

photo resist

c)

photomask

d)

microchip

42.

In 1968, Noyce and Moore teamed up and founded a new company, the largest chip maker today: ___

a)

NVIDIA

b)

Qualcomm

c)

Texas Instruments

d)

Intel

43.

How many transistors were contained in the Intel 4004 CPU, the first microprocessor?

a)

23

b)

230

c)

2,300

d)

23,000

44.

In what year did the transistor count in a CPU breach one billion?

a)

1980

b)

1990

c)

2000

d)

2010

45.

Advantages of IC over Discrete Component

a)

Provides signal and power distribution.

b)

Provides mechanical support.

c)

Low power consumption

d)

Draws heat away from the Chip

46.

Functions of Integrated Circuit (IC) packages?

a)

Very Low Weight

b)

High reliability

c)

Easy replacement

d)

Draws heat away from the Chip

47.

Etching is used for:

a)

Selective removal of the unwanted surface

b)

Cleaning

c)

Interconnection

d)

Protection

48.

Which one of the following is not commonly used for deposition of films in Microelectronic devices processing

a)

Polysilicon

b)

Polyethylene

c)

Silicon nitride

d)

Silicon dioxide

49.

Most widely used oxide in IC technology today is

a)

Aluminium oxide

b)

Silicon nitride

c)

Carbon dioxide

d)

Silicon dioxide

50.

The process by which the geometric patterns that define devices are transferred to the substrate surface are is called as

a)

Calligraphy

b)

Lithography

c)

Photography

d)

Oxidation

51.

The main drawback of Electron-beam and Ion-beam lithography is

a)

less scan time

b)

low resolution than photolithography

c)

low current density

d)

beams have to be maintained in a vacuum

52.

For wire bonding , the wires were made of

a)

Gold

b)

Platinum

c)

Copper

d)

Silver

53.

Which of the following is the fastest, smallest, and cheapest per unit to implement a given complex circuit in large volume?

a)

FPGA

b)

ASIC

c)

PLA

d)

CPLD

54.

What are the advantages of smaller transistor sizes?

a)

Lower switching speeds

b)

Higher current

c)

More transistors per unit area

d)

Higher gate voltage

55.

Bonding Pad of IC show in ______________

a)

A

b)

B

c)

C

d)

D

56.

N-well is formed by ______

a)

Decomposition

b)

Diffusion

c)

Dispersion

d)

Filtering

57.

In nMOS device, gate material could be ____________

a)

Silicon

b)

Polysilicon

c)

Boron

d)

Phosphorus

58.

Stick diagrams are those which convey layer information through

a)

Thickness

b)

Color

c)

Shape

d)

Layers

59.

nMOS devices are formed in _________

a)

p-type substrate of high doping level

b)

n-type substrate of low doping level

c)

p-type substrate of moderate doping level

d)

n-type substrate of high doping level

60.

____ technology is preferred than________ technology

a)

NMOS,PMOS

b)

PMOS,NMOS

c)

NMOS,CMOS

d)

PMOS,CMOS

61.

Few parts of photoresist layer is removed by using _________

a)

Acidic Solution

b)

Neutral Solution

c)

Pure Water

d)

Diluted Water

62.

What significant advancement in electronics occurred in 1947 at Bell Labs?

a)

Invention of the vacuum tube

b)

Invention of the transistor

c)

Development of the microprocessor

d)

Introduction of integrated circuits

63.

Which innovation by Jack Kilby in 1958 revolutionized electronics manufacturing?

a)

Transistor

b)

Vacuum tube

c)

Microprocessor

d)

Integrated circuit (IC)

64.

What was the primary motivation for developing the Intel 4004 microprocessor in 1971?

a)

To power early personal computers

b)

To revolutionize telecommunications

c)

To create advanced gaming consoles

d)

To build calculators

65.

What did Gordon Moore's observation in 1965, known as Moore's Law, state?

a)

The number of transistors on a chip doubles approximately every two years.

b)

The speed of microprocessors increases linearly over time.

c)

The cost of integrated circuits decreases exponentially.

d)

The size of vacuum tubes remains constant.

66.

Which microprocessor introduced the x86 architecture and its 16-bit design?

a)

Intel 4004

b)

Intel 8080

c)

Intel 8086

d)

Intel 8008

67.

What was the key advancement introduced by the Pentium series of microprocessors in 1993?

a)

Superscalar architecture

b)

32-bit processing

c)

Reduced power consumption

d)

Compatibility with vacuum tubes

68.

Which microprocessor architecture could address a memory system of 16M bytes?

a)

Intel 8086

b)

Intel 80286

c)

Intel 8080

d)

Intel 4004

69.

What was the primary reason for the introduction of the 80286 microprocessor in 1983?

a)

To address the limitations of a 1M-byte memory system

b)

To replace the 8086 microprocessor

c)

To create a more energy-efficient microprocessor

d)

To focus on instruction simplification

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