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WorksheetsIntegrated Circuit Final Quiz 1
Total questions: 15
Worksheet time: 8mins
Who developed the first integrated circuit in the 1950s?
Jack Kilby
None of the above
Robert Noyce
Both Jack Kilby and Robert Noyce
Which classification of integrated circuit includes up to 100 electronic components per chip?
MSI
LSI
SSI
VLSI
What is the current technology used to make microprocessors?
Deep-ultraviolet lithography
Laser technology
Extreme-ultraviolet lithography
Photography
What is the key to creating more powerful microprocessors?
Number of mirrors used
Size of the light's wavelength
Type of semiconductor material
Amount of photoresist used
Who predicted the phenomenon of the number of transistors on a microprocessor doubling every 18 months?
Robert Noyce
Bill Gates
Jack Kilby
Gordon Moore
What is the advantage of being a member of the EUV LLC consortium?
Guaranteed profits from chip sales
Free training on chipmaking techniques
Access to advanced chipmaking technology
Exclusive rights to EUV lithography patents
What is the process used to create the mask for EUV lithography?
Transferred onto a substrate using a plasma
Patterned onto a mirror using an absorber
Printed onto a film using a laser
Projected onto a silicon wafer using lenses
What is the wavelength of light used in deep-ultraviolet lithography as of 2001?
240 nanometers
100 nanometers
193 nanometers
13 nanometers
What is the main advantage of using EUV lithography over deep-ultraviolet lithography?
Use of concave and convex mirrors
Ability to work in a vacuum
Shorter wavelength of light
Coating of mirrors with molybdenum and silicon
What is the main challenge in EUV lithography related to the mirrors?
Maintaining nearly perfect mirror surfaces
Focusing the light onto the mask
Reducing the absorption of EUV light
Creating a plasma from xenon gas
What is the expected clock speed of the industry's first 10-gigahertz microprocessor by 2007?
2.4 GHz
5 GHz
10 GHz
20 GHz
What is the smallest circuit that can be created by deep-ultraviolet lithography?
30 nanometers
1 micrometer
100 nanometers
240 nanometers
What is the main reason for using shorter wavelengths in chipmaking?
To increase the quality of the pattern projected onto a silicon wafer
To decrease the number of mirrors used
To reduce the cost of chip production
To improve the durability of the silicon wafer
What is the main reason for conducting the EUVL process in a vacuum?
To increase the speed of the lithography process
To prevent air from absorbing the short wavelengths of light
To reduce the interference of plasma from xenon gas
To maintain the temperature of the silicon wafer
What is the coating on the mirrors in EUV lithography primarily made of?
Platinum and palladium
Aluminum and copper
Gold and silver
Molybdenum and silicon
