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WorksheetsPrinted Circuit Board Production Final Quiz 3
Total questions: 20
Worksheet time: 10mins
What is the primary purpose of the solder mask in circuit board production?
To restrict the areas covered with solder
To remove surface contamination
To smooth the surface of the pads
To improve adhesion of the copper surface
What is the thickness of the electroless copper deposit on the panel?
1.5 mils
1.34 mils
1 mil
45-60 inches
What is the purpose of the desmear process in multi-layer board fabrication?
To improve adhesion of the copper surface
To restrict the areas covered with solder
To remove the thin coating of resin from the inner layer connections
To chemically deposit copper on all exposed surfaces
What is the purpose of the oxide coating on the panels?
To improve adhesion of the copper surface
To chemically deposit copper on all exposed surfaces
To restrict the areas covered with solder
To remove surface contamination
What is the purpose of the deburr process in circuit board production?
To remove the raised edges of the metal or burrs surrounding the holes
To restrict the areas covered with solder
To chemically deposit copper on all exposed surfaces
To improve adhesion of the copper surface
What is the primary purpose of the legend or nomenclature ink in circuit board production?
To dictate component placement, part number or name, date code, logo or other specified information
To remove surface contamination
To restrict the areas covered with solder
To improve adhesion of the copper surface
What is the purpose of the tin plating step in circuit board production?
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To maintain the copper traces, hole pads and walls during the outer layer etch process
To improve adhesion of the copper surface
What is the purpose of the dry-film resist coating on the outer layer panels?
To improve adhesion of the copper surface
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To create an image of the circuit pattern and expose the copper pads and hole defined by the artwork
What is the purpose of the image expose process in circuit board production?
To restrict the areas covered with solder
To improve adhesion of the copper surface
To remove the raised edges of the metal or burrs surrounding the holes
To create an image of the circuit pattern similar to a negative and a photograph
What is the purpose of the multi-layer construction process in circuit board production?
To improve adhesion of the copper surface
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To bond the inner layer cores together using copper foil and prepreg
What is the purpose of the inner layer etch process in circuit board production?
To restrict the areas covered with solder
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To remove the raised edges of the metal or burrs surrounding the holes
To improve adhesion of the copper surface
What is the purpose of the dry-film resist coating on the inner layer core material?
To improve adhesion of the copper surface
To apply a light sensitive film or photo image-able resist to the metal surfaces of the core
To remove the raised edges of the metal or burrs surrounding the holes
To restrict the areas covered with solder
What is the purpose of the multi-layer board fabrication process?
To improve adhesion of the copper surface
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To create a board with several layers of copper inside as well as the foil on the outside
What is the purpose of the single sided board in circuit board production?
To create a board made from rigid laminate consisting of a woven glass epoxy base material clad with copper on one side
To remove the raised edges of the metal or burrs surrounding the holes
To restrict the areas covered with solder
To improve adhesion of the copper surface
What is the purpose of the multi-layer board in circuit board production?
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To improve adhesion of the copper surface
To create a board made from the same base material with copper foil on the top & bottom and one or more “inner layer” cores
What is the purpose of the conformal coating in circuit board production?
To protect the board from moisture, dust, chemicals, and temperature extremes
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To improve adhesion of the copper surface
To create an image of the circuit pattern similar to a negative and a photograph
What is the purpose of the solder paste stencil in circuit board production?
To restrict the areas covered with solder
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To improve adhesion of the copper surface
To create an image of the circuit pattern similar to a negative and a photograph
What is the purpose of the wave soldering process in circuit board production?
To create an image of the circuit pattern similar to a negative and a photograph
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To improve adhesion of the copper surface
To solder all the through-hole components on the board in one step
What is the purpose of the solder mask in PCB production?
To protect the board from moisture, dust, chemicals, and temperature extremes
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To improve adhesion of the copper surface
To create an image of the circuit pattern similar to a negative and a photograph
What is the primary purpose of the conformal coating in circuit board production?
To protect the board from moisture, dust, chemicals, and temperature extremes
To chemically remove the copper from the core in all areas not covered by the dry-film resist
To improve adhesion of the copper surface
To create an image of the circuit pattern similar to a negative and a photograph
