WorksheetsME6601_L9
Total questions: 3
Worksheet time: 2mins
Name
Class
Date
1.
Which image is/are NOT taken from TEM?
a)
b)
c)
d)
2.
In the context of semiconductor manufacturing, what is a common application of TEM?
a)
(A) Detecting surface contaminants
b)
(B) Imaging and analyzing transistor gate oxide layers
c)
(C) Measuring wafer thickness
d)
(D) Studying mechanical deformation of large components
3.
What is a limitation of TEM that manufacturers must consider during routine material analysis?
a)
(A) TEM requires conductive materials to function
b)
(B) TEM provides only qualitative data
c)
(C) TEM sample preparation can lead to structural changes or damage
d)
(D) TEM is ideal for analyzing rough, unpolished surfaces
100 %
