WorksheetsCIP Task 206 - Explain Cooling Methods and Devices
Total questions: 10
Worksheet time: 5mins
What is the purpose of thermal paste?
Improve heat transfer between CPU and heat sink
Reduce fan noise
Supply power to the CPU
Secure the heat sink to the motherboard
Which cooling method uses no moving parts?
Passive cooling (heat sink)
Active cooling (fans)
Liquid cooling
Phase-change cooling
Which term describes airflow moving through a case from front to back or bottom to top?
Air cooling
Cross-ventilation
Heat sink effect
Immersion cooling
Which cooling method uses water blocks, pumps, and radiators?
Liquid cooling
Air cooling
Passive cooling
Heat pipe
What problem is most likely if fans are installed incorrectly in a case?
Airflow disruption
Faster CPU speeds
Reduced voltage
More storage space
Which cooling system is most often used in servers and datacenters?
Redundant fans with hot/cold aisle design
Liquid nitrogen cooling
Phase-change cooling
Immersion oil cooling
Which type of cooling requires replacing or reapplying material during maintenance?
Thermal paste
Passive cooling
Fan cooling
Immersion cooling
Which of the following is an advantage of liquid cooling over air cooling?
Better heat dissipation under high loads
Lower installation cost
No chance of leaks
Works without electricity
What component is most likely to use a dedicated cooling solution?
CPU
RAM
CMOS battery
Hard drive LED
What is the main risk of not cleaning dust from cooling systems?
Overheating and shutdowns
Loss of storage capacity
Motherboard socket damage
Weaker network signal
