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APR MCQ Exam — Automatic Placement & Routing

Total questions: 83

Worksheet time: 42mins

Name
Class
Date
1.

Select the best answer for each question. No external materials allowed. According to the General Physical Synthesis Flow, what is the first step?

a)

Placement

b)

Routing

c)

Floorplanning

d)

Clock Tree Synthesis

2.

Select the best answer for each question. No external materials allowed. Which of the following correctly describes the steps of Routing in the General Physical Synthesis Flow?

a)

Global routing followed by Detailed routing

b)

Detailed routing followed by Global routing

c)

Power routing followed by Signal routing

d)

Clock routing followed by Data routing

3.

Select the best answer for each question. No external materials allowed. What is the primary function of Floorplanning?

a)

To arrange standard cells within a block

b)

To determine sizes and locations of all blocks

c)

To connect all nets by metal interconnects

d)

To perform DRV and LVS checks

4.

Select the best answer for each question. No external materials allowed. Which of the following is an explicit INPUT to the Floorplanning step?

a)

Parasitic extraction file

b)

Final layout with wiring

c)

Hierarchical structural netlist used cells and connections

d)

GDSII file

5.

Select the best answer for each question. No external materials allowed. In Floorplanning, chip size constraints are used to ensure the design fits in the:

a)

Test bench

b)

Package cavity

c)

Wafer scribe line

d)

Reticle limit

6.

Select the best answer for each question. No external materials allowed. Which of the following is an OUTPUT of the Floorplanning process?

a)

Detailed transistor layout

b)

Decide blocks size & location

c)

Final metal routing paths

d)

Post-layout simulation results

7.

Select the best answer for each question. No external materials allowed. In the Floorplanning phase, which decision is marked as "Optional" in the slides?

a)

Decide location of I/O pads

b)

Decide routing areas (channel assignment)

c)

Decide location of power pads

d)

Decide blocks size

8.

Select the best answer for each question. No external materials allowed. The Floorplanning phase decides the location and style of distribution for which two critical signal types?

a)

Power and Clock

b)

Reset and Enable

c)

Data and Control

d)

Scan and Test

9.

Select the best answer for each question. No external materials allowed. What is the main Optimization goal during Floorplanning?

a)

Optimize overall chip area while minimize routing lengths

b)

Optimize transistor switching speed

c)

Minimize number of I/O pads

d)

Minimize manufacturing yield loss

10.

Select the best answer for each question. No external materials allowed. Floorplanning involves applying an algorithm to optimize block location, orientation, and:

a)

Transistor sizing

b)

Aspect-ratio and pin locations

c)

Metal layer thickness

d)

Oxide capacitance

11.

Select the best answer for each question. No external materials allowed. Which of the following is classified as a "Fixed block" or "Hard IP" during floorplanning?

a)

Standard cells

b)

Flexible blocks

c)

Analog blocks and memories

d)

Unplaced logic gates

12.

Select the best answer for each question. No external materials allowed. Flexible blocks (Soft IPs) are characterized by being:

a)

Built from standard cells and not yet placed

b)

Fully routed and hardened

c)

Analog components with fixed geometry

d)

External chips on the PCB

13.

Select the best answer for each question. No external materials allowed. For Flexible blocks (Soft IPs), which properties are adjustable during placement?

a)

Transistor threshold voltages

b)

Aspect-ratio and pin-locations

c)

Supply voltage levels

d)

Metal layer count

14.

Select the best answer for each question. No external materials allowed. Which signal nets need "special attention" during Floorplanning?

a)

Data bus nets

b)

Power supply and clock signal nets

c)

Scan chain nets

d)

GPIO control nets

15.

Select the best answer for each question. No external materials allowed. According to the slides, what is performed as part of Floorplanning regarding power/clock?

a)

Sizing and final topology

b)

Architecture and structure

c)

Detailed routing

d)

Parasitic extraction

16.

Select the best answer for each question. No external materials allowed. The Clock distribution should be designed to minimize:

a)

Skew & jitter

b)

Resistance & capacitance only

c)

Blockage & congestion

d)

Area & leakage

17.

Select the best answer for each question. No external materials allowed. Which phenomenon causes IR drop in the supply?

a)

Wire inductance

b)

Wire resistance

c)

Gate capacitance

d)

Subthreshold leakage

18.

Select the best answer for each question. No external materials allowed. Which phenomenon causes Inductive drop in the supply?

a)

Wire resistance

b)

Wire capacitance

c)

Wire inductance

d)

Dielectric breakdown

19.

Select the best answer for each question. No external materials allowed. What does the Power distribution network add to minimize IR drop?

a)

Pad capacitors

b)

Rings & straps

c)

Level shifters

d)

Clock buffers

20.

What does the Power distribution network add to minimize Inductive drop?

a)

Rings & straps

b)

Pad capacitors

c)

Ferrite beads

d)

Voltage regulators

21.

What is the main function of Placement?

a)

Define the core boundary

b)

Arrange all cells within a flexible block

c)

Create metal interconnects for all nets

d)

Verify design rules

22.

Which of the following is an INPUT to the Placement step?

a)

Layout of block without routing

b)

Structural netlist of block

c)

Detailed routing instructions

d)

Extracted netlist

23.

Which of the following is an OUTPUT of the Placement step?

a)

Structural netlist of block

b)

Block size constraints

c)

Layout of block without routing

d)

Synthesized gate-level netlist

24.

What is a primary Optimization goal during Placement?

a)

Optimize area while minimize routing lengths

b)

Minimize number of transistors

c)

Maximize clock frequency only

d)

Minimize fabrication cost

25.

Placement optimization must meet timing constraints for:

a)

All nets

b)

Critical nets

c)

Power nets only

d)

Clock nets only

26.

Which Placement optimization is listed as "Optional" in the slides?

a)

Area optimization

b)

Routing length minimization

c)

Timing constraint satisfaction

d)

Optimize power & cross talk

27.

According to Cell Layout Rules, cells are made to be:

a)

Separated by guard rings

b)

Abutted

c)

Overlapped

d)

Rotated 45 degrees

28.

In Cell Layout Rules, cells must have:

a)

Same width, variable height

b)

Same height, variable width

c)

Same height, same width

d)

Variable height, variable width

29.

How do cells in a row share power connections?

a)

They share Vss/Vdd

b)

They use separate power wires

c)

They use external jumpers

d)

They connect to a central bus only

30.

What is the benefit of Mirrored top & bottom Rows?

a)

Shared Clock lines

b)

Shared Input pins

c)

Shared Vdd and Vss

d)

Reduced cell height

31.

For routing INSIDE all cells, the layout uses:

a)

Only limited layers

b)

All available metal layers

c)

Only the top metal layer

d)

Only polysilicon

32.

High layers are used by the router to:

a)

Create transistors

b)

Connect signals over the cells

c)

Form the substrate body

d)

Create local interconnects

33.

In the Example: Cell Layout Rules, what is the Cell Height?

a)

24 lambda

b)

50 lambda

c)

6 lambda

d)

100 lambda

34.

In the Example: Cell Layout Rules, the Cell Width must be multiples of:

a)

2 lambda

b)

5 lambda

c)

6 lambda

d)

10 lambda

35.

In the Example: Cell Layout Rules, what is the width of VDD and VSS?

a)

5 lambda

b)

10 lambda

c)

6 lambda

d)

24 lambda

36.

In the Example: Cell Layout Rules, what is the NWELL Height?

a)

50 lambda

b)

6 lambda

c)

24 lambda

d)

12 lambda

37.

How much of the NWELL is outside the abutment box in the example?

a)

0 lambda

b)

1 lambda

c)

5 lambda

d)

6 lambda

38.

According to the slides, what is the Virtual Machine Path for all cells (.ap)?

a)

/home/user/design/cells

b)

/usr/bin/cadence/cells

c)

/usr/lib/alliance/cells

d)

/etc/vlsi/library

39.

What is the main definition of Routing?

a)

Arranging cells in rows

b)

Connect all nets by metal interconnects

c)

Verifying geometric rules

d)

Extracting parasitic capacitance

40.

Global Routing is responsible for:

a)

Performing metal interconnection of all nets

b)

Optimize routing paths for all nets

c)

Manufacturing the masks

d)

Placing I/O pads

41.

Detailed Routing is responsible for:

a)

Optimizing block locations

b)

Optimizing routing paths only

c)

Performs metal interconnection of all nets

d)

System-level partitioning

42.

During Global Routing, how are possible congestions solved?

a)

By adding more metal layers

b)

Can move cells/rows to make room for interconnections

c)

By decreasing the clock frequency

d)

By increasing chip size

43.

Which of the following are the Inputs for Global Routing?

a)

Chip floorplan and Placement information

b)

GDSII file and Tech file

c)

Netlist and Constraints only

d)

Extracted netlist and Delays

44.

What is the Output of Global Routing?

a)

Final GDSII file

b)

List of DRC violations

c)

Instructions to detailed router how to route every net

d)

Placed standard cells

45.

What is an Optimization goal of Global Routing?

a)

Minimize routing length especially for critical path

b)

Minimize cell density

c)

Maximize voltage swing

d)

Minimize latch-up risk

46.

Detailed Router creates:

a)

Global routing guides

b)

Metal interconnects for all nets

c)

Floorplan regions

d)

Clock tree buffers

47.

How does Detailed Routing optimize delay?

a)

By increasing wire width

b)

By decreasing voltage

c)

By moving blocks

d)

By adding repeaters

48.

Which optimization in Detailed Routing is marked as "Optional" in the slides?

a)

Minimize overlap/coupling capacitance

b)

Optimize wire width

c)

Metal interconnection

d)

Delay reduction

49.

Which of the following describes the Inputs to Detailed Routing?

a)

Gate-level netlist only

b)

Global routing instructions, Chip floorplan, and Placement information

c)

Final layout only

d)

Test vectors

50.

What is the Output of Detailed Routing?

a)

Global routing plan

b)

Final layout including all wiring

c)

Pre-layout simulation report

d)

Timing constraints file

51.

Which command is shown in the slides for Example: Routing Layout?

a)

$ routing -start

b)

$ graal -l filename

c)

$ place_and_route

d)

$ magic -exclude

52.

What does LVS (Layout vs. Schematic) check?

a)

Checks layout against geometric rules

b)

Checks layout devices and connectivity have one-to-one correspondence with gate-level netlist

c)

Checks layout against electrical rules

d)

Checks timing violations

53.

What does DRC (Design Rules Check) check?

a)

Checks layout against geometric rules

b)

Checks connectivity

c)

Checks electrical rules

d)

Checks logic functionality

54.

What does ERC (Electric Rules Check) check?

a)

Checks layout against geometric rules

b)

Checks layout devices

c)

Checks layout against electrical rules

d)

Checks antenna effects

55.

In the Physical Verification flow diagram, what is compared against the Extracted Netlist?

a)

Layout

b)

Gate-level netlist (Schematic)

c)

GDSII

d)

Simulation Waveforms

56.

Why is Parasitics Extraction / Post-Layout Simulation necessary?

a)

Because logic synthesis provides perfect delays

b)

Because adding wires have big impact on delays & circuit performance

c)

Because placement & routing do not estimate wire length

d)

Because standard cells have no delay

57.

What does Parasitics Extraction (PEX) generate?

a)

Final GDSII

b)

Extracted netlist including interconnect parasitics

c)

Behavioral VHDL

d)

Standard cell library

58.

What is the function of Delay Back-Annotation?

a)

Generates delays based on parasitics and replaces them in the extracted netlist

b)

Removes delays from the netlist

c)

Synthesizes the clock tree

d)

Performs formal verification

59.

What does Post-layout Simulation check?

a)

Logic functionality without delays

b)

Performance of the extracted netlist with delays

c)

Geometric design rules

d)

Power consumption only

60.

In the General Chip Integration Flow, what is the first step?

a)

Global power distribution

b)

Adding pads

c)

Global clock distribution

d)

Chip physical verification

61.

In the General Chip Integration Flow, what comes immediately after Adding pads?

a)

Tape-out

b)

Chip physical verification

c)

Global power distribution

d)

GDS generation

62.

In the General Chip Integration Flow, what is step 3?

a)

Global clock distribution

b)

Adding pads

c)

Tape-out

d)

DRC

63.

In the General Chip Integration Flow, what is step 4?

a)

GDS generation

b)

Chip physical verification

c)

Global power distribution

d)

Adding pads

64.

What is the final step (Step 5) of the Chip Integration Flow?

a)

Adding pads

b)

Global clock distribution

c)

GDS generation (Tape-out)

d)

Netlist extraction

65.

According to the Pad Frame example, pads use level shifters to standard external supplies of:

a)

5V/12V

b)

1.0V/0.8V

c)

220V

d)

3.3V/2.5V/1.8V

66.

The chip must have which two supplies?

a)

Internal (core) supply & External (pad) supply

b)

Digital supply & Analog supply only

c)

High voltage & Low voltage only

d)

AC & DC supply

67.

Pad rings are continuous metal rings connected by abutment. What is used for continuity at corners?

a)

Jumper wires

b)

Corner cell

c)

Via arrays

d)

Wire bonds

68.

What does an Input pad contain?

a)

Cascaded buffer

b)

PLL

c)

ESD protection, clamps, level-shifter, resistor

d)

Clock divider

69.

What does an Output pad contain?

a)

ESD protection only

b)

Level-shifter, cascaded buffer to drive large load

c)

Sense amplifier

d)

ADC

70.

Why are multiple distributed supply pads used?

a)

To increase resistance

b)

To reduce overall series inductance

c)

To increase chip area

d)

To look symmetric

71.

Why are VDD and GND pads placed next to each other?

a)

To reduce overall inductance

b)

To increase capacitance

c)

To simplify bonding

d)

To avoid short circuits

72.

Where are Power rings placed in the Power Distribution Strategy?

a)

Inside the core

b)

Around the core to have multiple access points

c)

Only at the corners

d)

Outside the pad frame

73.

How are Power rings connected?

a)

To corresponding pads

b)

To each other only

c)

To the substrate only

d)

To clock lines

74.

Does the Clock pad have an internal access to the core?

a)

Yes, direct access

b)

No, it does not have an internal access to core

c)

Only in 5nm technology

d)

Depends on the frequency

75.

Where is a clock ring formed?

a)

In the core center

b)

In the padframe when all pads are placed

c)

On the PCB

d)

In the package

76.

How is the clock signal delivered to the core if the Clock pad has no internal access?

a)

Through the substrate

b)

Power pads have versions with clock buffers and core access

c)

Wireless transmission

d)

Through the scribe lines

77.

For large cores, what is suggested regarding clock access?

a)

Use only one access point

b)

Can use multiple core access

c)

Remove the clock ring

d)

Use a slower clock

78.

In the Clock Distribution Strategy diagram, what does `vdde` represent?

a)

VDD_core

b)

VDD_pad

c)

VSS_core

d)

Clock input

79.

In the Clock Distribution Strategy diagram, what does `vssi` represent?

a)

VSS_pad

b)

VDD_pad

c)

VSS_core

d)

Clock output

80.

What is the format of the Structural VHDL file mentioned in Chip Netlist?

a)

.vst

b)

.vhd

c)

.v

d)

.txt

81.

To know pad cell pins, one should open the pad (.vbe) in which path?

a)

/usr/local/bin

b)

/home/cadence/lib

c)

/usr/lib/alliance/cells/padlib

d)

/etc/cells

82.

In addition to common pins, the `pvssick_sp` pad has which specific pin?

a)

reset

b)

cko (clock, must be connected to core)

c)

scan_en

d)

test_mode

83.

Regarding the netlist note: Power supplies vdd, vss, vdde, and vsse are:

a)

Not connected in pads

b)

Connected in all pads, but not shown in this netlist

c)

Shown explicitly in every line

d)

Not used in this design