Soldering and Brazing Concepts

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Soldering

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Joining copper pieces using a filler metal (solder) with a melting point below 450 °C (840 °F).

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Brazing

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Joining copper pieces using a filler metal with a melting point above 450 °C (840 °F), creating a stronger bond than soldering.

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Flux

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A chemical cleaning agent applied before soldering or brazing to remove oxides and improve bonding.

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Capillary Action

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The movement of molten filler metal into the joint gap between copper parts during soldering or brazing.

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Filler Metal

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The metal used to join copper parts, such as tin-lead solder or silver-based brazing alloy.

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Oxidation

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The formation of copper oxide on the surface when heated, which must be removed for proper bonding.

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Torch

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A tool producing a controlled flame for heating copper during soldering or brazing.

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Joint Clearance

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The precise gap between copper parts to ensure proper capillary flow of the filler metal.

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Heat Sink

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A material or tool used to absorb excess heat to prevent damage to nearby components when soldering copper.

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Annealing

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The process of heating copper to soften it, often done before or after brazing to reduce stress in the metal.