Search Header Logo

Service HP

Authored by SUYUD AHMAD

Professional Development

Professional Development

Used 1+ times

Service HP
AI

AI Actions

Add similar questions

Adjust reading levels

Convert to real-world scenario

Translate activity

More...

    Content View

    Student View

14 questions

Show all answers

1.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Untuk membersihkan mata solder dipergunakan

a. Kain lap kering

b. Spon

c. Kain lap basah

d. Spon basah

2.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Salah satu kegunaan timah gulung adalah:

a. Memasang jumper

b. Memasang casing

c. Memasang IC BGA

d. Memasang kamera

3.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Untuk membersihkan sisa-sisa timah setelah proses pengangkatan IC dipergunakan:

a. Thiner

b. Kain lap

c. Solder wick

d. Flux

4.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Salah satu alat yang dipergunakan untuk mencetak IC BGA adalah:

a. Solder station

b. Penjepit PCB mesin ponsel

c. Solder wick

d. Plat BGA

5.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Nama lain dari penjepit PCB mesin ponsel adalah:

a. PCB Plastic Holder

b. PCB Metal Holder

c. PCB Ponsel

d. Tempat PCB

6.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Lampu service ponsel sering juga disebut dengan:

a. Lampu LED

b. Lampu Lup

c. Lampu LCD

d. Lampu Lap

7.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Solder uap disebut juga dengan:

a. Solder angin

b. Solder udara

c. Hot Air Soldering

d. Solder elemen

Access all questions and much more by creating a free account

Create resources

Host any resource

Get auto-graded reports

Google

Continue with Google

Email

Continue with Email

Classlink

Continue with Classlink

Clever

Continue with Clever

or continue with

Microsoft

Microsoft

Apple

Apple

Others

Others

Already have an account?