Printed Circuit Board Production Final Quiz 3
Authored by Melvin Bascones
Instructional Technology
University
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20 questions
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1.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the primary purpose of the solder mask in circuit board production?
To restrict the areas covered with solder
To remove surface contamination
To smooth the surface of the pads
To improve adhesion of the copper surface
2.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the thickness of the electroless copper deposit on the panel?
1.5 mils
1.34 mils
1 mil
45-60 inches
3.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the purpose of the desmear process in multi-layer board fabrication?
To improve adhesion of the copper surface
To restrict the areas covered with solder
To remove the thin coating of resin from the inner layer connections
To chemically deposit copper on all exposed surfaces
4.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the purpose of the oxide coating on the panels?
To improve adhesion of the copper surface
To chemically deposit copper on all exposed surfaces
To restrict the areas covered with solder
To remove surface contamination
5.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the purpose of the deburr process in circuit board production?
To remove the raised edges of the metal or burrs surrounding the holes
To restrict the areas covered with solder
To chemically deposit copper on all exposed surfaces
To improve adhesion of the copper surface
6.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the primary purpose of the legend or nomenclature ink in circuit board production?
To dictate component placement, part number or name, date code, logo or other specified information
To remove surface contamination
To restrict the areas covered with solder
To improve adhesion of the copper surface
7.
MULTIPLE CHOICE QUESTION
30 sec • 1 pt
What is the purpose of the tin plating step in circuit board production?
To restrict the areas covered with solder
To remove the raised edges of the metal or burrs surrounding the holes
To maintain the copper traces, hole pads and walls during the outer layer etch process
To improve adhesion of the copper surface
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