Printed Circuit Board Production Final Quiz 3

What is the primary purpose of the solder mask in circuit board production?

• To restrict the areas covered with solder

• To remove surface contamination

• To smooth the surface of the pads

• To improve adhesion of the copper surface

What is the thickness of the electroless copper deposit on the panel?

• 1.5 mils

• 1.34 mils

• 1 mil

• 45-60 inches

What is the purpose of the desmear process in multi-layer board fabrication?

• To improve adhesion of the copper surface

• To restrict the areas covered with solder

• To remove the thin coating of resin from the inner layer connections

• To chemically deposit copper on all exposed surfaces

What is the purpose of the oxide coating on the panels?

• To improve adhesion of the copper surface

• To chemically deposit copper on all exposed surfaces

• To restrict the areas covered with solder

• To remove surface contamination

What is the purpose of the deburr process in circuit board production?

• To remove the raised edges of the metal or burrs surrounding the holes

• To restrict the areas covered with solder

• To chemically deposit copper on all exposed surfaces

• To improve adhesion of the copper surface

What is the primary purpose of the legend or nomenclature ink in circuit board production?

• To dictate component placement, part number or name, date code, logo or other specified information

• To remove surface contamination

• To restrict the areas covered with solder

• To improve adhesion of the copper surface

What is the purpose of the tin plating step in circuit board production?

• To restrict the areas covered with solder

• To remove the raised edges of the metal or burrs surrounding the holes

• To maintain the copper traces, hole pads and walls during the outer layer etch process

• To improve adhesion of the copper surface

What is the purpose of the dry-film resist coating on the outer layer panels?

• To improve adhesion of the copper surface

• To restrict the areas covered with solder

• To remove the raised edges of the metal or burrs surrounding the holes

• To create an image of the circuit pattern and expose the copper pads and hole defined by the artwork

What is the purpose of the image expose process in circuit board production?

• To restrict the areas covered with solder

• To improve adhesion of the copper surface

• To remove the raised edges of the metal or burrs surrounding the holes

• To create an image of the circuit pattern similar to a negative and a photograph

What is the purpose of the multi-layer construction process in circuit board production?

• To improve adhesion of the copper surface

• To restrict the areas covered with solder

• To remove the raised edges of the metal or burrs surrounding the holes

• To bond the inner layer cores together using copper foil and prepreg