Ion Beam Etching (IBE) primarily utilizes:

• A) Chemical reactions

• B) Physical sputtering

• C) Thermal decomposition

• D) Electroplating

What is the primary purpose of etching in microfabrication?

• A) To clean the substrate

• B) To deposit material

• C) To remove material

• D) To inspect the substrate

Which gas is commonly used in silicon etching via Reactive Ion Etching (RIE)?

• A) Nitrogen

• B) Oxygen

• C) Sulfur Hexafluoride (SF6)

• D) Hydrogen

Deep Reactive Ion Etching (DRIE) is known for its ability to create:

• A) Low aspect ratio features

• B) High aspect ratio features

• C) Isotropic profiles

• D) Metallic layers

The Bosch process, used in DRIE, alternates between:

• A) Etching and cleaning

• B) Deposition and etching

• C) Etching and passivation

• D) Passivation and cleaning

What type of etching process is Reactive Ion Etching (RIE)?

• A) Wet etching

• B) Dry etching

• C) Thermal etching

• D) Electrochemical etching

Which of the following is an isotropic wet etching agent for silicon dioxide?

• A) Phosphoric Acid

• B) Hydrofluoric Acid (HF)

• C) Potassium Hydroxide (KOH)

• D) Chlorine Gas

Which of the following materials is typically used as a mask in silicon wet etching?

• A) Copper

• B) Silicon Nitride (Si3N4)

• C) Gold

• D) Zinc

In Inductively Coupled Plasma (ICP) etching, the plasma is generated using:

• A) A direct current (DC) source

• B) A chemical reaction

• C) An inductively coupled radio frequency (RF) source

• D) A capacitive coupling method

Which of the following is an example of a wet etchant for silicon?

• A) Argon

• B) Potassium Hydroxide (KOH)

• C) Plasma

• D) Gold