MCQs on Total-Etch Adhesive

The smear layer is removed during the total-etch adhesive process to:

• Enhance bond strength

• Protect the pulp

• Minimize post-operative sensitivity

• Create a surface for microleakage

The hybrid layer in total-etch adhesives is composed of:

• Etched enamel and a layer of bonding agent

• Demineralized dentin and resin tags

• Phosphoric acid and hydroxyapatite

• Unreacted resin monomers and enamel crystals

Total-etch adhesives require etching of enamel to improve:

• Surface roughness

• Bond strength

• Opacity

• Fluoride uptake

After applying phosphoric acid in total-etch adhesives, what is the next step in the bonding process?

• Rinse and dry thoroughly

• Apply the bonding agent

• Light-cure for 10 seconds

• Etch the enamel again

One disadvantage of using total-etch adhesives is:

• Reduced technique sensitivity

• Simpler application procedure

• Enhanced bond strength to dentin

• Less risk of enamel demineralization

The application of total-etch adhesives involves:

• Applying the bonding agent directly onto unetched enamel

• Etching enamel and dentin separately before applying the adhesive

• Rinsing the etched surfaces with water and then applying the adhesive

• Using a separate primer and bonding agent for dentin and enamel

Total-etch adhesives are known for their excellent bond strength to:

• Only enamel

• Only dentin

• Both enamel and dentin

• Metal restorations

Total-etch adhesives primarily use which component to etch enamel and dentin?

• Phosphoric acid

• Ethanol

• Hydroxyapatite

• MDP (10-Methacryloyloxydecyl dihydrogen phosphate)

One disadvantage of total-etch adhesives compared to self-etch adhesives is:

• Reduced bond strength to dentin

• Higher risk of enamel demineralization

• Longer application time

• Limited compatibility with composite materials

The bond strength of total-etch adhesives is influenced by:

• pH of the bonding agent

• Length of time the adhesive is left on the surface

• Thickness of the adhesive layer

• Application pressure during placement