CEB1124
Authored by MOHAMMAD AZIB BIN KHAIRUDIN KPM-Guru
Instructional Technology
University
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30 questions
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1.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah tujuan kertas penerangan ini?
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2.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur pemisahan bahagian elektronik rosak?
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OFF
3.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah kaedah jalinan untuk penyediaan pad pelekap permukaan?
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OFF
4.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah penting untuk mengelakkan meletakkan tekanan ke bawah atau sisi pad pada keringan apabila menggunakan haba?
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5.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah kaedah peranti vakum desolder yang digunakan untuk penyediaan pad pelekap permukaan?
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OFF
6.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur yang termasuk dalam soldering surface mount chip components, point-to-point method?
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OFF
7.
OPEN ENDED QUESTION
3 mins • 1 pt
Apakah prosedur untuk menukar komponen pada papan litar tercetak?
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OFF
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