Quiz on Semiconductor Fabrication Techniques

What is the primary purpose of deposition in semiconductor fabrication?

• To remove excess material

• To apply a thin layer of material onto a substrate

• To etch patterns into the substrate

• To cool down the semiconductor wafer

Which technique involves the use of a Langmuir trough?

• Dip coating

• Langmuir-Blodgett films

• Photo-lithography

• Spin coating

What is a key advantage of dip coating?

• High precision

• Complexity of the process

• Cost-effectiveness

• Speed of deposition

What is the role of photoresist in photolithography?

• To cool the substrate

• To deposit thin films

• To create a mask for patterning

• To etch the substrate

What happens during the soft bake step in photolithography?

• The substrate is cooled

• The photoresist is removed

• The substrate is exposed to UV light

• Solvent is removed to enhance adhesion

Which of the following is NOT a deposition technique mentioned?

• Inkjet printing

• Thermal evaporation

• Electrochemical deposition

• Chemical vapor deposition

What is the main disadvantage of spin coating?

• It cannot be used for large areas

• It may not provide precise control over film thickness

• It requires expensive equipment

• It is too fast

In the context of Langmuir-Blodgett films, what is a Langmuir monolayer?

• A multilayer film

• A single layer of molecules

• A type of substrate

• A chemical solution

What is the purpose of the hard bake step in photolithography?

• To remove the photoresist

• To stabilize the developed pattern

• To apply a thin film

• To cool the substrate

Which of the following describes the process of ion implantation?

• Depositing a thin layer of metal

• Injecting ions into a substrate

• Coating a substrate with photoresist

• Etching patterns into a film