Chip Stacking and CPU Technology Quiz

What is the primary benefit of using die stacking in storage devices like SSDs?

• Increased processing speed

• Enhanced graphics performance

• Improved battery life

• Higher storage capacity

What is the main advantage of Intel's Foveros technology in their Lakefield chips?

• Reduced manufacturing costs

• Increased number of CPU cores

• Improved energy efficiency and performance

• Enhanced graphics capabilities

How does AMD's approach to die stacking differ from Intel's?

• AMD uses a single 2D surface

• AMD stacks multiple processors

• AMD focuses on increasing CPU cache

• AMD uses micro bumps for connectivity

What technology does AMD use to connect cache layers in their die stacking strategy?

• Micro bumps

• Through silicon vias (TSVs)

• Optical fibers

• Wireless connections

What potential performance gain does AMD claim from their increased cache sizes?

• 5-20% more frames per second

• 2-10% more frames per second

• 4-25% more frames per second

• 10-30% more frames per second