WorksheetsThin film Technology
Total questions: 26
Worksheet time: 52mins
Which of the following method/s is/are used to improve the adhesion of a thin film?
High-energy pre-sputtering
Low-energy pre-sputtering
Photo resist primer
Chemical etching/cleaning
Which deposition technique(s) should you use to get uniform thickness over an uneven substrate with trenches?
Chemical Vapor Deposition
Sputtering
Physical Vapor Deposition (PVD) by evaporation
Atomic Layer Deposition
For which conditions will a thin film have larger grains?
High deposition rate and high substrate temperature
High deposition rate and low substrate temperature
Low deposition rate and high substrate temperature
Low deposition rate and low substrate temperature
Spectroscopic Ellipsometry is an optical technique used for
thickness
optical constants
micro structure
All of these
Which of the following is not a stage of annealing?
Grain size reduction
Dispersion hardening
Solid solution strengthening
Strain hardening
According to Drude's model, which of the following statement is incorrect
Electrons are free and independent;
Motion of electrons is modeled as kinetic theory of gases;
Compensating positive ions are immobile;
After collision with ions, the velocity of electron is zero
The increase in liquid hydro static pressure
Increases the breakdown strength
Decreases the breakdown strength
Does not affect the breakdown strength
None of these
Liquids dielectrics are mainly used as
Thick film technology
Thin film technology
Thin and thick film technology
None of the mentioned
A TCO is a semiconductor which has:
high electrical resistivity and high optical transparency
high electrical conductivity and high optical transparency
high electrical conductivity and low optical transparency
ow electrical resistivity and low optical transparency
Fine grain sizes are obtained by
slow cooling
increasing nucleation
decreasing growth rate
Fast cooling.
Film Thickness Monitor (FTM) crystals ----------are used to determine the thickness of material deposited
quartz
Silicon
GaInP
SiC
Metals are normally deposited using which of the following deposition processes.
Spin-on
Thermal oxidation
Physical vapor deposition
Chemical vapor deposition
SI unit of conductivity of material is
Ω m
Ω
Ω-1m
Ω-1m-1
Energy band gap size for insulators is in the range ________ eV.
1-2
2-3
3-4
> 4
Which of the following factors does not influence the variety and quality of metal?
Rate of heating and cooling
Quenching medium
Grain size
Furnace
How does the rate of cooling affect the hardness of the metal?
Slow cooling, hard material
Slow cooling, soft material
Rapid cooling, soft material
No effective change
Which of the following is not a stage of annealing?
Heating
Soaking
Tempering
Quenching
Graphene is a:
wide band-gap semiconductor
gapless-band semiconductor
a narrow bandgap semiconductor
not a semiconductor but behaves like graphite
Which statement is incorrect about semiconductors?
charge carrier may be either a positive hole or an electron
Ga-doped Si is a p-type semiconductor
n- and p-type semiconductors are intrinsic semiconductors
Doping Si with As introduces a donor level below the conduction band
When the source of light is not sun light then the photo voltaic cell is used as _______
Photo diode
Photo voltaic cell
Photo detector
Photo transmitter
What is the insulator used in most MOS-FET?
CO2
SiO2
mica
plastic
When the source of light is not sun light then the photo voltaic cell is used as _______
diode
photodiode
transistor
solarcell
the frequency range of infrared region
430 THz down to 300 GHz
421 THz down to 200 GHz
100 THz down to 4 MHz
1 THz down to 4 MHz
using the Scherrer formula we found
grain size
crystallite size
particle size
None of these
How is the process of film deposition carried out in cathode sputtering?
Slower than evaporation method
Faster than evaporation method
Similar to same as evaporation method
All of the mentioned
Which of the following method/s is/are used to improve the adhesion of a thin film?
High-energy pre-sputtering
Low-energy pre-sputtering
Photo resist primer
Chemical etching/cleaning
