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Vel Tech TBI PCB Quiz

Total questions: 25

Worksheet time: 13mins

Name
Class
Date
1.

PCB are classified into ……… types

a)

7

b)

6

c)

8

d)

5

2.

conductor width is a constraint of ……type

a)

Rigid –flex PCB. 

b)

Flexible PCB. 

c)

High frequency PCB. 

d)

Low frequency PCB

3.

The material used for flexible PCB is

a)

FR4

b)

 Teflon

c)

Kapton

d)

ABS

4.

The 60:40 Ratio in soldering melts at temperature of

a)

361F

b)

316F

c)

315F

d)

351F

5.

 Infrared soldering is a type of

a)

Wave

b)

reflow

c)

single wave

d)

vapour phase

6.

Flux is classified into

a)

3

b)

5

c)

4

d)

6

7.

among the following which is an active component

a)

Transistor

b)

 Inductor

c)

thyristor

d)

Amplifier

8.

Diodes are classified into

a)

9

b)

10

c)

12

d)

8

9.

ICs are classified into

a)

3

b)

5

c)

4

d)

2

10.

ESD means

a)

Electrostatic discharge

b)

Electrostatic distortion

c)

Electrostatic derivative

d)

Electrostatic disturbance

11.

Wave soldering process is divided into …….steps

a)

6

b)

5

c)

4

d)

8

12.

Soldering rod is having a temperature of

a)

400C

b)

450C

c)

470C

d)

420C

13.

The soldering machine should be calibrated in ……months

a)

10

b)

11

c)

12

d)

14

14.

There are ……..parts in BOM

a)

3

b)

4

c)

5

d)

6

15.

Solder defects are classified into ………types

a)

18

b)

20

c)

22

d)

24

16.

SMT is divided into ….types

a)

3

b)

4

c)

5

d)

6

17.

How many steps are there in SMT Technology?

a)

4

b)

5

c)

6

d)

7

18.

Soldering paste can be applied by

a)

Chemical deposition

b)

vapour deposition

c)

Screen printing

d)

ink jet printing

19.

Soldering technique is divided into ….

a)

2

b)

3

c)

4

d)

5

20.

Short EM wave will be applied in

a)

Wave soldering

b)

 IR soldering

c)

lead soldering

d)

 tin soldering

21.

The process of misalignment of chip in smt is called as

a)

Skewing

b)

side overhang

c)

mounting on side

d)

measling

22.

The process of validating circuit board is

a)

PFT

b)

 PTF

c)

 PTTF

d)

PFFT

23.

The process of testing chip with probe is called as

a)

PFT

b)

 ICT

c)

 PTF

d)

PTTF

24.

The process of misplacing of IC chip is called as

a)

Tombstoning

b)

side overhanging

c)

Bridging

d)

Blistering

25.

The over material deposition is called as

a)

Dewetting

b)

solder bridging

c)

nonwetting

d)

skewing