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SURE Trust - Integrated VLSI(G2) Quiz 1 -

Total questions: 20

Worksheet time: 20mins

Name
Class
Date
1.

A twin tub CMOS process used to manufacture integrated circuits has:

a)

None of these

b)

Both N-Well and P-Well

c)

P-Well

d)

N-Well

2.

Metallic Grade Silicon (MGS) used to manufacture Electronics Grade Silicon (EGS) is:

a)

90 % pure

b)

98 % pure

c)

99.999 % pure

d)

None of these

3.

In lithography, on exposure to ultraviolet light ( UV Light ) a negative photoresist:

a)

Dissolves

b)

Polymerizes

c)

Evaporates

d)

None of these

4.

Electronic Grade Silicon (EGS) used to make silicon wafers is:

a)

90 % pure

b)

98 % pure

c)

99.999 % pure

d)

None of these

5.

Gate oxide of a MOSFET is made of:

a)

Silicon

b)

Silicon Dioxide

c)

Silicon Nitride

d)

None of these

6.

The bulk terminal of the NMOS transistor in a CMOS inverter is connected to:

a)

VDD

b)

VSS

c)

Either of VDD or VSS

d)

None of these

7.

In a CMOS process, resistors can be made using:

a)

Polysilicon

b)

N Well

c)

N Type and P Type diffusions

d)

All of these

8.

Oxidation of silicon to form silicon dioxide can be done using:

a)

Dry oxidation method

b)

Wet oxidation method

c)

Both

d)

None

9.

In a CMOS process N Well and N Type and P Type diffusions can be formed using:

a)

Diffusion

b)

Ion Implantation

c)

Both

d)

None

10.

In a CMOS process, capacitors can be formed using:

a)

Two layers of polysilicon with oxide in between

b)

Two layers of metal with oxide in between

c)

MOSFET biased and used as a capacitor

d)

All of these

11.

What is the effect of Drain Induced barrier lowering on Vt?

a)

Vt increases

b)

Vt decreases

c)

Vt remains same

d)

does not effect Vt

12.

How do you model channel length modulation in MOSFET small signal model?

a)

Current source

b)

Resistor

c)

Capacitor

d)

Voltage source

13.

A mosfet in linear region can be modeled as?

a)

Current source

b)

Resistor

c)

Capacitor

d)

Open circuit

14.

What does MOSFET stand for

a)

Metal-oxide-semiconductor-field-effect-transistor

b)

Metal-On-Sillicon-field-effect-transistor

c)

Magnetic-oxide-sillicon-field-effect-transistor

d)

Microchip-oxide-sillicon-field-effect-transistor

15.

What parameter characterizes the sensitivity of a MOSFET to changes in gate voltage?

a)

Transconductance

b)

Threshold voltage

c)

Drain current

d)

Gate capacitance

16.

What happens to the pinch off point in saturation as you increase VDS ?

a)

Moves towards drain

b)

moves away from drain

c)

doesn’t effect

d)

None of the above

17.

What happens to current ID of MOSFET with CLM

(Channel length modulation)?

a)

Current remains same

b)

No current

c)

Current increases

d)

Current decreases

18.

Body effect occurs in which case of bulk connection VB for an nmos?

a)

VB= 0

b)

VB= -ve

c)

VB= VS

d)

VB > 0

19.

Why velocity saturation happens in MOSFET

a)

because of high drain voltage

b)

because of high Electric field between S & D

c)

because of high gate voltage

d)

because of high electric field between gate & channel

20.

MOSFET is a

a)

Current controlled current source

b)

Voltage controlled current source

c)

Voltage controlled voltage source

d)

Current controlled voltage source