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WorksheetsIntegrated Circuit Fabrication
Total questions: 10
Worksheet time: 3mins
What is the primary material used as a substrate for IC fabrication?
Copper
Silicon
Gold
Aluminum
Which method is commonly used to grow single-crystal silicon ingots?
Chemical Vapor Deposition (CVD)
Reactive Ion Etching (RIE)
Czochralski Method
Photolithography
What is the purpose of photolithography in IC fabrication?
Slicing the wafer into dies
Depositing thin layers on the wafer
Creating circuit patterns using light
Removing contaminants from the wafer
Which process involves bombarding the wafer with ions to change conductivity?
Annealing
Doping/Implantation
Etching
Sputtering
What is the main role of the final packaging in IC fabrication?
Testing IC performance
Providing electrical connections and protection
Cutting wafers into individual dies
Forming circuit layers
In the IC fabrication process, which technique uses plasma to deposit thin films?
Physical Vapor Deposition (PVD)
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Thermal Oxidation
Evaporation
The purpose of annealing is to repair damage caused by ion implantation.
True
False
Reactive Ion Etching (RIE) is a chemical method for adding material to the wafer.
True
False
The process of slicing a silicon ingot into thin wafers is known as dicing.
True
False
What IC fabrication process uses light to create circuit patterns on the wafer?
(a)
