WorksheetsMEMS Fabrication Techniques Quiz
Total questions: 20
Worksheet time: 10mins
Which of the following is the primary technique for transferring patterns onto a substrate in MEMS fabrication?
Etching
Lithography
Deposition
Doping
In photolithography, the material coated on the wafer before exposure to UV light is called:
Etchant
Photoresist
Catalyst
Mask
Which etching technique provides high anisotropy and better control over feature size?
Wet etching
Isotropic etching
Reactive Ion Etching (RIE)
Chemical Polishing
Which of the following deposition techniques is commonly used for thin film growth in MEMS?
Physical Vapor Deposition (PVD)
Chemical Vapor Deposition (CVD)
Electroplating
All of the above
The wafer bonding technique that does not require intermediate adhesive layers is:
Anodic bonding
Direct wafer bonding
Fusion bonding
All of the above
The most common method for forming silicon dioxide (SiO₂) layers in MEMS is:
Physical Vapor Deposition (PVD)
Electroplating
Thermal Oxidation
Spin Coating
Which type of oxidation involves the presence of both oxygen and water vapor?
Dry oxidation
Wet oxidation
Plasma oxidation
Anodic oxidation
In Chemical Vapor Deposition (CVD), the thin film is formed by:
Mechanical polishing of wafers
Chemical reaction of gaseous precursors on the substrate surface
Direct melting of silicon
Ion implantation
Which one of the following is a key advantage of Low-Pressure CVD (LPCVD)?
Low deposition rate
Poor film uniformity
Excellent step coverage
High contamination levels
A common insulating layer formed in MEMS devices using CVD is:
Polysilicon
Silicon nitride (Si₃N₄)
Aluminum
Gold
In bulk micromachining, the structures are created by:
Depositing thin films on the substrate
Removing portions of the substrate material
Adding polymers by electroplating
Printing with photopolymers
Which micromachining technique is most suitable for creating high aspect ratio structures?
Surface micromachining
LIGA
Bulk micromachining
Lithography only
Surface micromachining typically relies on which type of material as a sacrificial layer?
Silicon dioxide (SiO₂)
Silicon dioxide (SiO₂)
Polysilicon
Photoresist
The LIGA process derives its name from German words. What does 'LIGA' stand for?
Lithography, Ion-beam etching, Gas deposition, Annealing
Lithographie, Galvanoformung, Abformung
Light Induced Growth Assembly
Laser Integrated Growth Application
In surface micromachining, the structural layer is usually made of:
Gold
Glass
Polysilicon
Photoresist
Bulk micromachining is widely used to fabricate:
MEMS accelerometers and pressure sensors
Optical gratings with polymers
High-resolution masks
Integrated circuits only
Which etching process is most commonly used in bulk micromachining to achieve deep structures?
Wet isotropic etching
Spin coating
Deep Reactive Ion Etching (DRIE)
Sputtering
In surface micromachining, after deposition of the structural layer, the sacrificial layer is:
Left as part of the device
Etched away to release movable structures
Oxidized to form SiO₂
Replaced with a seed layer
A major advantage of LIGA over conventional micromachining techniques is:
Low cost
Simple process flow
Ability to produce very high aspect ratio microstructures
Limited material selection
Which micromanufacturing technique is more compatible with standard IC fabrication processes?
LIGA
Bulk micromachining
Surface micromachining
Electroplating
