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WorksheetsQUIZ NO.2
Total questions: 41
Worksheet time: 28mins
What is the main reason for testing PCBs during manufacture and use?
To reduce the cost of raw materials
To minimize waste and costly product recalls
To increase product size
To improve design appearance
Which of the following can result from poor PCB design?
Short circuits
Open circuits
Heat damage
All of the above
What happens when traces are laid out at sharp angles, trapping acid?
Starved thermals
Edge short circuits
Acid traps
Narrow traces
What does PCB stand for?
Printed Copper Board
Printed Circuit Board
Parallel Circuit Base
Power Control Board
What separates the layers of conductors in a PCB?
Air gaps
Adhesive film
Insulating material
Metal plating
The insulating material commonly used in PCBs is:
FR-4
PVC
Aluminum oxide
Bakelite
What is the dielectric constant of FR-4?
2
3
4
6
The simplest type of PCB is called a:
Multilayer PCB
Double-sided PCB
Single-sided PCB
Flexible PCB
What can happen if traces on a PCB are too narrow?
They may break or wear off
They improve conductivity
They strengthen the board
They prevent overheating
When a conductor is too close to an edge and shorts against another layer, it’s called:
Acid trap
Starved thermal
Edge short circuit
Open circuit
The metal most commonly used for PCB tracks is:
Aluminum
Copper
Silver
Zinc
What are the holes drilled through a PCB called?
Pads
Ports
Vias
Nodes
Starved thermals result in______
Excessive heat buildup
Increased cooling
Reduced current
More efficient soldering
Which of the following is true about design flaws?
They are easy to fix after production
They can be corrected by repainting
They often require a PCB redesign
They don’t affect performance
What organization created the J-STD-001C soldering standard?
IEEE
ISO
IPC
ASTM
The J-STD-001C standard defines:
PCB layout colors
Soldering methods and verification
Component lifespan
PCB packaging
A soldering defect that causes a loss of connection between the pin and pad is called:
Open circuit
Short circuit
Starved thermal
Edge short
A solder bridge that connects unintended parts causes what type of defect?
Open circuit
Short circuit
Design flaw
Delamination
What must be used to find bad solder joints?
Strong lighting
Testing equipment
Extra flux
Manual inspection only
Component failure may result from_____
Design flaws
Soldering flaws
Manufacturing issues
All of the above
What is the process where PCB layers separate due to vapor or stress?
Oxidation
Delamination
Starved thermal
Edge short
What usually determines the operational life expectancy of a PCB?
Its color
Its ability to handle heat
Its size
Its manufacturer
Soldering flaws are always caused by poor-quality components.
TRUE
FALSE
Narrow traces can lead to both open and short circuits.
TRUE
FALSE
Delamination can result from improper PCB storage.
TRUE
FALSE
Once a PCB is delaminated, it can easily be repaired.
TRUE
FALSE
Heat and thermal cycling can damage the PCB base material.
TRUE
FALSE
Two-sided PCBs allow metal tracks on both sides of the board.
TRUE
FALSE
Multi-layer PCBs can have up to six layers or more.
TRUE
FALSE
Flux in solder helps prevent oxidation and improves solder flow.
TRUE
FALSE
(a) are caused when etching acid gets trapped at sharp trace angles.
A thin metal conductor that breaks off due to narrowness can cause an (a) .
(a) occurs when a conductor near an edge shorts with other layers.
The separation of PCB layers due to vapor or heat stress is known as (a) .
PCBs that fail due to severe damage usually require complete (a) .
Holes that connect metal tracks from top to bottom are called (a) .
When component legs pass through holes in the board, they are called (a) components.
The flux inside solder helps by (a) the metal surfaces.
The process of coating a metal surface with solder is called (a) .
The insulating base material used in most PCBs is called (a) .
NAME:
