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Fabrication and Self-Assembly Quiz

Total questions: 10

Worksheet time: 8mins

Name
Class
Date
1.

Which fabrication approach involves removing small sections from a larger material?

a)

Top-down

b)

Bottom-up

c)

Self-assembly

d)

Layer-by-layer

2.

The bottom-up fabrication method is particularly important because it:

a)

Is faster than top-down fabrication

b)

Uses lithography masks

c)

Has high versatility and creativity in nanotechnology

d)

Removes material selectively

3.

Which molecular interaction is responsible for Coulombic attraction between charged particles in self-assembly?

a)

Hydrogen bonding

b)

Dispersion forces

c)

Hydrophobic effects

d)

Electrostatic forces

4.

Which of the following is a characteristic of Self-Assembled Monolayers (SAMs)?

a)

Micrometer-thick layers

b)

Random molecular orientation

c)

Few molecules thick

d)

Require external electric fields

5.

What is the main driving force for surface aggregation in SAM formation?

a)

Thermal expansion

b)

Covalent bonding between film molecules and the substrate

c)

Laser activation

d)

Mechanical compression

6.

In electrostatic self-assembly, how are multiple layers formed on a surface?

a)

By increasing UV exposure time

b)

By spin coating repeatedly

c)

By increasing solution concentration

d)

By alternating oppositely charged layers

7.

The layer-by-layer electrostatic self-assembly method relies primarily on:

a)

Van der Waals forces only

b)

Electrostatic interactions between charged species

c)

Hydrogen bonding

d)

Covalent cross-linking

8.

One major advantage of Self-Assembled Monolayers (SAMs) is that they can:

a)

Replace semiconductor materials

b)

Increase bulk material thickness

c)

Modify surface properties using nanometer-thick layers

d)

Eliminate the need for substrates

9.

Self-assembly of integrated systems typically follows which construction principle?

a)

Large structures assembled first

b)

Random aggregation of components

c)

Smaller units assembled into larger hierarchical structures

d)

Single-step fabrication

10.

Which of the following is a reported application of Self-Assembled Monolayers (SAMs) in the lecture notes?

a)

Semiconductor doping

b)

Corrosion protection

c)

Wafer dicing

d)

Thermal oxidation