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IC TESTING AND VERIFICATION

Total questions: 10

Worksheet time: 5mins

Name
Class
Date
1.

What is IC testing?

a)

Process of designing IC

b)

Process of packaging IC

c)

Process to check whether IC not working properly

d)

Process of selling IC

2.

IC testing is done at how many levels?

a)

1 level

b)

2 level

c)

3 level

d)

4 level

3.

Which of the following is NOT a general IC test?

a)

Shorting condition

b)

Leakage condition

c)

Colour testing

d)

Input and output condition

4.

What is IC verification?

a)

Checking IC size

b)

Demonstrating functional correctness of IC design

c)

Packaging the IC

d)

Separating IC from wafer

5.

When does wafer testing take place?

a)

Before IC separation

b)

After IC packaging

c)

After IC is sold

d)

During IC design

6.

What tool is used to test IC on the wafer?

a)

Camera

b)

Soldering iron

c)

Cutter

d)

Probe

7.

How are individual ICs separated from the wafer?

a)

Scoring with diamond cutter

b)

Melting

c)

Chemical reaction

d)

Laser printing

8.

What happens to ICs that fail wafer testing?

a)

Repaired

b)

Upgraded

c)

Marked and discarded

d)

Sold cheaply

9.

What is die and wire bonding used for?

a)

Cutting IC

b)

Testing IC speed

c)

Connecting IC to package leads

d)

Measuring IC size

10.

What does ESD stand for?

a)

Electrical System Device

b)

Energy Storage Device

c)

Electronic Signal Detection

d)

Electrostatic Discharge