IC PACKAGING

In electronics manufacturing, is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion

• Packaging

• Testing

• Decapsulation

Other names for packaging include ______

• semiconductor device assembly

• encapsulation

• sealing

• all answers are correct

____ is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards.

• Electronic Packaging

• Integrated Circuit Packaging

• Both answers are correct

• Both answers are wrong

This type of package houses a small semiconducting die, with nanowires attaching the die to the lead frames, allowing for electrical connections to be made to a PCB.

• SIP

• DIP

• BGA

Meaning of JEDEC

• Joint Electron Device Engineering Council

• Joint Electronics Device Engineering Council

• Joint Electronics Device Engineering Corporation

_____ is a family of semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads

• DO 204

• TO 204

• Both are correct

• Both are wrong

______ is a designation for a group of semiconductor packages for surface mounted diodes.

• Small Outlier Diode

• Surface Outline Diode

• Small Outline Diode

For Diode, the standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. SOD-123 is the _____ , SOD-923 is the ______ .

• largest - smallest

• smallest - largest

_____ is a widely used style of semiconductor package mainly used for transistors.

• DO - 92

• TO - 92

• SO -92

_____ is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.

• dual in-line pin package

• single in-line pin package

• transistor in-line package