ECE411_Etching

Which etching process has the best directionality?

• Wet Etching

• Plasma Etching

• RIE Etching

• Ion Sputtering

Which etching process has the best selectivity?

• Wet Etching

• Plasma Etching

• RIE Etching

• Ion Sputtering

Different etch rates in different directions is called

• Selectivity

• Directionality

• Preferentiality

• Speed

If the etch rate of a certain etchant in Silicon is 10 nm/min and in Silicon dioxide is 100 nm/min, then the selectivity of this Silicon dioxide etchant to Silicon is

• 10

• 0.1

• 1

Which dry etching process has more free radicals than charged ions?

• Ion Sputtering

• Plasma Etching

• RIE Etching

If the etch rate of a certain etchant in Silicon is 10 nm/min and in Silicon dioxide is 100 nm/min, then the selectivity of this Silicon dioxide etchant to Silicon is

• 10

• 0.1

• 1