High Speed PCB

Pick C as answer

• A

• B

• C

• D

• Non of the above

Which of the statements is true

• Incident current and return current cancel each other

• High speed board has signals with high operating frequency and high rise/fall time

• Insufficient decoupling power system is not affecting SI quality

• Non of the above

In series termination, where the resistor being placed?

• Receiver side

• Driver side

• Power side

• Upper side

How to reduce EMI problem

• GND via placed far from the transitioning via when traces changes layer

• Maintain continuous reference plane

• Not maintaining trace impedance

Among the methods of controlling the EMI below, which 3 will be the widely used in our design? 

i. Minimise loop area(H) 

ii. Use stripline to route signal 

iii. Use Ground guard for high speed routing 

iV. 20H rules 

• i, ii, iv

• i, ii, iii

• ii, iii, iv

Which of the stackup criteria below caused surge/increase transmission line impedances? 

  

i. Lower copper ounces(T) 

ii. Smaller trace width(W) 

iii. Thicker prepeg distance from the adjacent reference layer(H, H1) 

iv. Smaller dielectric constant (Er) 

• i, ii, iii

• i, ii, iv

• ii, iii, iv

• All of the above

What will be the most accurate reason for using fiber weave routing in PCB high speed designs?

• To reduce the EMI interferences from adjacent signals and to reduce the impact of crosstalk. 

• To reduce the impact of impedance mismatched caused by the Dk and Df variation from fiberglass pattern.

What techniques can we use ensure constant differential impedance between the close separated portion and far separated portion as in the image below:  

i. Reduce the trace width of the far separated portion 

ii. Create voids under the connector pads 

iii. Reduce  the far separated portion by routing the traces closer by bending them inwards 

iv. Increase the trace width of the far separated portion 

• i, ii, iii

• i, ii, iv

• ii, iii, iv

• All of the above

Which of the following will help to minimize crosstalk?

• Keep parallel coupled length as short as possible

• Make Stack up route trace as close as possible to Ref plane, H

• Avoid disturbance of the signal return path

• All of the statement

Using configurable IC to set the slew rate (i) and set the drive strength (ii) helps to reduce ground bounce.

• i. Faster

  ii. Stronger

• i. Faster

  ii. Weaker

• i. Slower

  ii. Stronger

• i. Slower

  ii. Weaker