Sputtering Technique Quiz

What type of process is sputtering primarily used for?

• Chemical reaction

• Thermal evaporation

• Physical vapor deposition

• Electroplating

Which gas is most commonly used in the sputtering process?

• Hydrogen

• Oxygen

• Argon

• Nitrogen

What is the primary mechanism that causes atoms to be ejected from the target material in sputtering?

• Chemical reaction

• Thermal evaporation

• Ion bombardment

• Electromagnetic radiation

What is the term for the average number of atoms ejected from the target per incident ion?

• Deposition rate

• Sputtering yield

• Ionization efficiency

• Collision frequency

Which of the following is an advantage of the sputtering technique?

• High deposition rate

• Minimal vacuum requirements

• Ability to coat complex shapes uniformly

• Low equipment cost

Sputtering is commonly used in the fabrication of:

• Pharmaceuticals

• Textiles

• Integrated circuits

• Food packaging

Which parameter does NOT directly affect the sputtering process?

• Target material

• Chamber pressure

• Substrate temperature

• Color of the substrate

In sputtering, the material that is deposited onto the substrate is known as the:

• Sputterate

• Target

• Film

• Plasma

What is the role of plasma in the sputtering process?

• To heat the substrate

• To provide ions for bombarding the target

• To increase the chemical reactivity of the target

• To enhance the optical properties of the film

Magnetron sputtering is a variant of the sputtering technique that uses:

• Higher temperatures

• A magnetic field

• Acoustic waves

• Organic solvents