Chap 3: IC Assembly

What is the purpose of IC assembly?

• To handle small bond pads and finer pitches on the IC

• To enable ICs to be interconnected with the rest of the system

• To reduce the weight of the IC

• To provide acceptable electrical properties

Which of the following is NOT a primary requirement for IC assembly?

• To provide a low-cost solution

• High throughput manufacturing

• High reliability

• To have a high number of I/O interconnections

What are the three primary IC assembly technologies mentioned in the text?

• Wirebond, Soldering, Flip Chip

• TAB, Wirebonding, BGA

• Flip Chip, TAB, Wirebond

• BGA, Soldering, TAB

Which material is typically used for wire bonding in moulded plastic packages?

• Silver wire

• Gold wire

• Aluminium wire

• Copper wire

What is the main advantage of Tape Automated Bonding (TAB)?

• Improved electrical performance

• Reduced weight

• Low defect rates or high yield interconnection processing

• Ability to handle high I/O counts

What is the purpose of the adhesion layer in Flip Chip technology?

• To provide strong interfaces between bump, chip metallization and chip passivation

• To improve the thermal capabilities of the chip

• To prevent diffusion of metal species and ionic contaminants

• To provide a consumable layer for the subsequent bump metallization to wet

Which of the following is NOT a limitation of Wirebonding technology?

• Slower interconnection rates due to point-to-point processing of each wirebond

• Larger footprint required for chip to package interconnection

• Potential for wire sweep during encapsulation overmolding

• Ability to handle high I/O counts

What is the main disadvantage of Flip Chip technology?

• Relatively little production infrastructure

• Improved electrical performance

• Lower cost compared to wire bonding

• Better thermal capabilities

How many main process methods are mentioned in the text for Flip Chip technology?

• Five

• Four

• Three

• Two

What is the primary concern at the metallurgical bond pad interface?

• Formation of brittle intermetallic compound at IMC

• Corrosion of the bond pad

• Inter-diffusion of metal

• Effect on thermomechanical reliability and electrical stability