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WorksheetsASM WORKSHOP POST EVALUATION
Total questions: 25
Worksheet time: 13mins
Reject if clip is not properly inserted on the bottomframe leadside X and Y alignment slots.
Tilted Clip
Wrong Die Position
Poor Solder Wetting
Cold Solder
Reject if solder spread is not in 100% visible in contact on source dimple or gate dimple periphery.
Poor Solder Wetting
Damaged Leadframe/Bottomframe/Clipframe
Wrong Solder Used
Contamination on Die
Reject if solder on top of the die causes bridging between two terminals.
Excessive Solder
Contamination/Oxidation on Die
Un-punched Tab Hole
Tilted Clip
Reject if solder on clip attach touches the die edge causing shorting the edge termination with the gate or source terminal.
Excessive Solder
Lifted Clip
Vacant Pad
Double Die Mount
Reject if the unit does not exhibits solder wetting either on the gate or source terminal.
Lifted Die
Wrong Die Bonded
Ink Fault Die
Poor Solder Wetting
True or False: For non-CD0S/LCD0S devices poor solder wetting criteria coverage is below 90%.
True
False
Maybe
Sometimes
What is the thawing time of solder paste?
3 hours
2 hours
4 hours
5 hours
What is the identified usage life of solder paste?
7 days
10 days
2 days
3 days
What reference document on the line where you can find the required solder paste, bottomframe, clipframe, die size, crystal type and the illustration of the product being worked on?
Wiring Diagram
SO tracking sheet
MPMF
BMC
What document on the line carries all the important information of the batch to be process (Batch number, Device type, Special Instruction, Batch Quantity, Number of rejects, etc.)?
MPMF
SO tracking sheet
Runcard
BMC
What document carries all the important information of sawn wafers to be processed?
Wafer sticker ID
Wafer ticket
Reject mapping sheet
SO tracking sheet
What part of the machine detects and measures the size and area of solder dispense?
Indexer orientation detector
Autovision system
Dispense tool
Clip frame detector
What reference document is use to check for the correct machine intervention procedure?
MPMF
BMC checklist
COI
Wiring Diagram
What machine accessory picks the die from Wafer table then transports it to the die pad area of the bottomframe?
Bridge pickup tool
Ejector pin
Rubber Tip
Solder Dispense tool
Indicates _________ on the name of magazine number on the runcard for easy identification of rejects.
star
Asterisk
heart
arrow
Which of the following must be performed after Change of Solder paste intervention?
SPI sampling
Solder thickness and Solder voids check
Visual inspection and Top solder X-ray check
Do nothing
How many needles are required on CD5, MCD5 and SD clipframe types?
Dual (2)
Single (1)
Three (3)
Four (4)
What is the identified bonding count of rubber tip at DACA?
Five thousand strokes (5,000)
Two hundred thousand strokes (200,000)
Thirty thousand strokes (30,000)
Three thouand strokes (3,000)
What option on the machine adjusts the height of solder paste dispense?
Learn Z height
Hairline adjustment
Air pressure adjustment
X and Y positioning
What must be done if there is an expired material (solder paste, clipframe, bottom frame) installed inside the machine or present in the worrking area?
Do not use and inform process engineering
Ignore it and just continue the process
Continue the process
Abandon the machine
What is the specification limits of solder voids for both PbSn and PbSnAg types?
10% max
17% max
75% max
50% max
What evaluation measuring technique is use to measure solder dispense area?
Smartscope
Mitutoyo Digimatic Indicator
Auto vision system
Dage
What evaluation measuring technique is use to measure solder thickness?
Auto Vision System
Mitutoyo Digimatic Indicator
Low Power Microscope
SPI
How many units on the leadframe the AOI must inspect?
50 units
5 units
100 units
10 units
What evaluation measuring technique is use to measure solder voids?
SPI
Softex / X-eye Xray
Smartscope
Mitutoyo Digimatic Indicator
