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WorksheetsOSAT FOL & EOL
Total questions: 10
Worksheet time: 5mins
Who is the market leader in OSAT business ?
ASE Group
Chipmos
TongFu Microelectronics
Powertech
The most frequently used semiconductor material is ?
Silicon
germanium
gallium
Aluminium
The purpose of back grinding is to_________
Minimize thickness
Improve aesthetics
Increase strength
Reduce diameter
Pick the maximum size of standard wafer _______
300 mm
650 mm
450 mm
200 mm
Identify the connection type _____
Wire bond
Clip Bond
Wedge bonding
Flip Chip
The term Die refers _______
Mold
Chip
Connecting pins
Bonding material
What would be the minimum clean room requirement for OSAT FOL ?
100K
1K
10 K
None
The process by which die are separated from a wafer of semiconductor is ?
Wafer Grinding
Tape attaching
Wafer Dicing
Curing
Identify the connection type _________
Wire bond
Clip Bond
Wedge bonding
Flip Chip
The most preffered bonding material used in wire bonding is______
Aluminium
Gold
Copper
Silver
