WorksheetsPCB Package Types
Total questions: 15
Worksheet time: 15mins
Which component package type requires leads to be inserted into drilled holes on the PCB?
Surface-Mount
Fine Pitch
Through-Hole
BGA
Which package type is best suited for automated assembly and high-density PCB designs?
Through-Hole
Surface-Mount
Press-Fit
DIP
Fine-pitch packages are characterized by:
Large spacing between pins
Pins arranged only on two sides
Very small distance between adjacent leads
No external leads
Which package uses solder balls instead of leads for electrical connections?
QFP
TFP
BGA
Through-Hole
FPGA devices are most commonly available in which package type due to high pin count?
DIP
BGA
SIP
TO-92
QFP (Quad Flat Package) components have:
Pins on only one side
Pins on two opposite sides
Pins on all four sides
No visible pins
Which package type is a thinner version of QFP with finer leads?
BGA
TFP
Through-Hole
Press-Fit
Press-Fit technology is mainly used when:
Soldering is mandatory
Temporary mounting is required
Solderless, reliable mechanical connections are needed
Components have very low pin count
Compared to Through-Hole components, Surface-Mount components generally:
Occupy more PCB area
Provide lower packing density
Enable smaller and lighter circuits
Cannot be machine assembled
Which package type poses challenges in inspection and rework due to hidden joints?
QFP
TFP
BGA
Through-Hole
Identify the image that represents a Through-Hole component package.
Select the image that represents a Surface-Mount Device (SMD)
Which image corresponds to a Ball Grid Array (BGA) package?
Identify the image that represents a Quad Flat Package (QFP).
Select the image that best represents a Press-Fit package or connector.
