CEDD LESSON 6 | WIRING AND CABLING DIAGRAMS ELECTRONIC PACKAGING

is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer.

is a major discipline within the field of mechanical engineering.

Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge.

• True

• False

Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts.

• True

• False

Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes.

• True

• False

Mass-market consumer devices may have highly specialized packaging to decrease consumer appeal.

• True

• False

Answer explanation

increase not decrease

"Chip," protecting a bare semiconductor die from contamination and damage.

• Level 0

• Level 1

• Level 2

• Level 3

Component, such as semiconductor package design and the packaging of other discrete components.

• Level 0

• Level 1

• Level 2

• Level 3

Etched wiring board (printed circuit board)

• Level 0

• Level 1

• Level 2

• Level 3

Module, assemblies integrated in an overall enclosure.

• Level 0

• Level 4

• Level 2

• Level 5