Reject if there is a metal deformation (flattened edge), on heatsink tab and leads induced during mold clamping, with dimension greater than 0.20mm or exceeds package outline dimension (POD).

Reject any evidence of impression or dent (assembly induced) on the heatsink back.

Reject if there is any intrusion cutting of heatsink.

Reject if the leads were not completely formed.f

Chipping on the planes of the plastic package exposing internal part (wire, crystal, solder, leadframe pad) with dimensions Greater than 4.0mm (Longer Side) or Greater than ______ mm (Shorter Side)

Reject if there is a mould flashes at the heatsink Greater than 10% measured from the encapsulation periphery.

Reject one or more scratches that exposes copper on front and back portion of the heatsink.

Reject if there is any portion of the heatsink bar, tie bar and / or index bar with punching mark but not totally cut during crop / singulation process.

Any foreign material attached on the backside package that affects the heatsink flatness.

Any sign of incompleteness of plastic package exposing wire, or crystal, or solder, or lead frame pad, and or center post.

Reject if unit had incomplete plating or no plating on the active surface region exposing nickel or copper base material.

Reject if void is greater than 0.50 mm in any direction and located at the edge of leads or pad or sidewall of a plastic package.